Integrated Vapor Chamber for Electronic Devices

    公开(公告)号:US20250081397A1

    公开(公告)日:2025-03-06

    申请号:US18934562

    申请日:2024-11-01

    Applicant: Google LLC

    Abstract: This document describes a vapor chamber within an electronic device. In aspects, an electronic device includes a middle frame that provides mechanical support for the electronic device, a middle plate affixed to the middle frame to define an inner layer of a chassis, and a vapor chamber disposed inside the middle plate. The vapor chamber includes a first region proximate to a heat source and a second region opposite the first region. A coolant is evaporated in a first mode at the first region by heat absorbed from the heat source and is condensed in a second mode in the second region. This vapor chamber permits cooling of elements within the electronic device at lower cost and/or smaller size than many conventional cooling systems.

Patent Agency Ranking