公开(公告)号：US10088242B1

公开(公告)日：2018-10-02

申请号：US14809412

申请日：2015-07-27

Applicant: Google LLC

Inventor： Felix Jose Alvarez Rivera ,  James Tanner ,  William Riis Hamburgen

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  F28D15/04

Abstract: In one aspect, a cooling system is provided for use in computing devices, such as laptops, cell phones, and tablet computers. The cooling system includes a heat spreader coupled to a radiator via a heat pipe having a midline. The heat pipe includes a first end portion longitudinally extending along the midline, a second end portion longitudinally extending along the midline, and a mid-portion longitudinally extending along the midline. The mid-portion is located between the first end portion and the second end portion and it has a thickness that is greater than the thicknesses of both the first portion and the second portion thereby reducing the overall thermal resistance of the heat pipe.