公开(公告)号：US11044834B1

公开(公告)日：2021-06-22

申请号：US16797450

申请日：2020-02-21

Applicant: Google LLC

Inventor： Michael Chi Kin Lau ,  William F. Edwards, Jr. ,  Justin S. Lee ,  Winnie Leung

IPC: H05K7/20 ,  H05K7/14

Abstract: An apparatus includes a housing having a bottom surface and one or more mounting members that enable the housing to be mounted in a rack. The apparatus includes liquid cooling components mounted within the housing. The liquid cooling components include tubing within which a coolant may be communicated, and a heat exchange component that thermally couples a heat load within the housing to the coolant so that heat from the heat load is transferred to the coolant. The bottom surface of the housing defines a drain path. The heat exchange component is positioned in a downward direction of gravity relative to the heat load when the housing is mounted in the rack. In the event of a coolant leak, the coolant leak will occur beneath the heat load and the coolant will flow away from the heat load and exit the housing by use of the drain path.