公开(公告)号：US20250102746A1

公开(公告)日：2025-03-27

申请号：US18372989

申请日：2023-09-26

Applicant: Google LLC

Inventor： Horia Alexandru Toma ,  Zuowei Shen ,  Ilyas Mohammed ,  Yingying Wang ,  William F. Edwards, Jr.

IPC: G02B6/42 ,  H10B80/00

Abstract: The technology generally relates to high bandwidth memory (HBM) packages and processor packages that have optical connectivity. Disclosed systems and methods herein allow for HBM dies that are interconnected with an optical interface in a manner that allows for compact, high-performance computing. An HBM package can be cooled using a cooling unit that is distinct from the processor package. In addition, the cooling unit can be configured so as to provide thermal contact with a subset of high-power components within the HBM package.

公开(公告)号：US12002795B2

公开(公告)日：2024-06-04

申请号：US17719857

申请日：2022-04-13

Applicant: Google LLC

Inventor： Houle Gan ,  Richard Stuart Roy ,  Yujeong Shim ,  William F. Edwards, Jr. ,  Chenhao Nan

IPC: H05K1/11 ,  H01L25/16 ,  H05K1/18 ,  H01L23/00

CPC classification number: H01L25/162 ,  H05K1/11 ,  H05K1/183 ,  H01L24/16 ,  H01L2224/16225 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10159 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10704 ,  H05K2201/10719

Abstract: A pluggable processor module includes a microprocessor package, a voltage regulator including a capacitor board, and contacts that each include a first side in contact with the microprocessor package and a second side in contact with the capacitor board. An assembly includes the pluggable processor module and a printed circuit board assembly (“PCBA”) including a module aperture that is large enough to receive the power board and narrower than the capacitor board.

公开(公告)号：US11249264B2

公开(公告)日：2022-02-15

申请号：US17122658

申请日：2020-12-15

Applicant: Google LLC

Inventor： William F. Edwards, Jr. ,  Melanie Beauchemin ,  Timothy Conrad Lee ,  Federico Pio Centola ,  Madhusudan K. Iyengar ,  Michael Chi Kin Lau ,  Zuowei Shen ,  Justin Sishung Lee

IPC: H04B10/00 ,  G02B6/42

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

公开(公告)号：US20220003946A1

公开(公告)日：2022-01-06

申请号：US17122658

申请日：2020-12-15

Applicant: Google LLC

Inventor： William F. Edwards, Jr. ,  Melanie Beauchemin ,  Timothy Conrad Lee ,  Federico Pio Centola ,  Madhusudan K. Iyengar ,  Michael Chi Kin Lau ,  Zuowei Shen ,  Justin Sishung Lee

IPC: G02B6/42

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

公开(公告)号：US11044834B1

公开(公告)日：2021-06-22

申请号：US16797450

申请日：2020-02-21

Applicant: Google LLC

Inventor： Michael Chi Kin Lau ,  William F. Edwards, Jr. ,  Justin S. Lee ,  Winnie Leung

IPC: H05K7/20 ,  H05K7/14

Abstract: An apparatus includes a housing having a bottom surface and one or more mounting members that enable the housing to be mounted in a rack. The apparatus includes liquid cooling components mounted within the housing. The liquid cooling components include tubing within which a coolant may be communicated, and a heat exchange component that thermally couples a heat load within the housing to the coolant so that heat from the heat load is transferred to the coolant. The bottom surface of the housing defines a drain path. The heat exchange component is positioned in a downward direction of gravity relative to the heat load when the housing is mounted in the rack. In the event of a coolant leak, the coolant leak will occur beneath the heat load and the coolant will flow away from the heat load and exit the housing by use of the drain path.

公开(公告)号：US11650384B2

公开(公告)日：2023-05-16

申请号：US17668062

申请日：2022-02-09

Applicant: Google LLC

Inventor： William F. Edwards, Jr. ,  Melanie Beauchemin ,  Timothy Conrad Lee ,  Federico Pio Centola ,  Madhusudan K. Iyengar ,  Michael Chi Kin Lau ,  Zuowei Shen ,  Justin Sishung Lee

IPC: H04B10/00 ,  G02B6/42

CPC classification number: G02B6/4269 ,  G02B6/428 ,  G02B6/4284

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.