公开(公告)号：US10108073B2

公开(公告)日：2018-10-23

申请号：US15487136

申请日：2017-04-13

Applicant: Google LLC

Inventor： Jerry Chiu ,  Katherine Stoy ,  Li-Ping Wang

IPC: G03B17/55 ,  H04N5/247 ,  H01L27/146 ,  H04N5/225

Abstract: A heat transfer apparatus includes a circuit board assembly and an image sensor including a plurality of photodetectors disposed in a semiconductor material. The image sensor is mounted to the circuit board assembly. A thermal strap with a first end is thermally coupled to transfer heat out of the image sensor. A heat sink is thermally coupled to a second end of the thermal strap opposite the first end of the thermal strap to receive heat from the image sensor.