公开(公告)号：US11197397B2

公开(公告)日：2021-12-07

申请号：US17095554

申请日：2020-11-11

Applicant: Google LLC

Inventor： Jerry Chiu ,  Skyler Salman ,  Madhusudan Krishnan Iyengar

IPC: H05K7/20

Abstract: Systems and methods for data center liquid cooling apparatus provisioning are described. In some aspects, such systems and methods may provision one or more data center liquid cooling apparatus, e.g., prior to such apparatus being put into service to a data center to cool data center devices, such as server trays (and more specifically, heat-generating devices such as processors, memories, voltage regulators, and other devices mounted on motherboards of the server trays). In some aspects, such liquid cooling apparatus include cold plates or evaporators that are mounted in thermal communication with the heat generating devices (in the server trays) and utilize a flow of a cooling liquid (e.g., water, glycol, refrigerant) to remove heat from the server tray (e.g., with or without a phase change of the cooling liquid).

公开(公告)号：US11044835B2

公开(公告)日：2021-06-22

申请号：US16706247

申请日：2019-12-06

Applicant: Google LLC

Inventor： Jerry Chiu ,  Gregory P. Imwalle ,  Emad Samadiani

IPC: H05K7/20

Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; a vapor chamber mounted on and in conductive thermal contact with the at least one heat generating processor device, the vapor chamber including a housing that defines an inner volume and encloses a working fluid; and a liquid cold plate assembly that includes a top portion mounted to at least one of the vapor chamber or the motherboard assembly and including a heat transfer member that includes an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member and formed on a top surface of the housing of the vapor chamber.

公开(公告)号：US12174676B2

公开(公告)日：2024-12-24

申请号：US17532147

申请日：2021-11-22

Applicant: Google LLC

Inventor： Jerry Chiu ,  Reza H. Khiabani ,  Xiaojin Wei ,  Madhusudan K. Iyengar

IPC: G06F1/20 ,  F28F1/00

Abstract: A heat exchanger includes a first manifold having an inlet opening and a second manifold having an outlet opening. A group of conduits fluidly connect the first manifold and the second manifold to one another such that a flow path is established for liquid to flow from the inlet opening to the outlet opening. The flow path includes a select portion that extends through all conduits within the group of conduits. Valves are located in the first manifold and the second manifold. The valves are operable to change the select portion of the flow path from between a first state, wherein the conduits within group of conduits are fluidly connected in parallel with one another, and a second state, wherein the conduits within the group of conduits are fluidly connected in series with one another.

公开(公告)号：US11462852B2

公开(公告)日：2022-10-04

申请号：US16993976

申请日：2020-08-14

Applicant: Google LLC

Inventor： Jerry Chiu ,  Melanie Beauchemin

IPC: H05K7/20 ,  H01R13/502 ,  G02B6/42 ,  H01R43/26

Abstract: The technology relates to a cage configured to removably receive a module. The cage may include a frame comprising a plurality of panels joined to one another, a lever pivotably coupled to the frame, and a heatsink pivotably coupled to the lever. The panels together may extend around a longitudinal recess configured to receive the module therein. The longitudinal recess may define a longitudinal axis thereof. A first one of the panels may have an aperture defined therein in communication with the longitudinal recess. A first end of the lever may extend into the longitudinal recess. The heatsink may be pivotably coupled to a second end of the lever opposite the first end. The heatsink may be movable in a translation direction transverse to the longitudinal axis. The heatsink may be translatable between a first position outside of the longitudinal recess and a second position partially inside the longitudinal recess.

公开(公告)号：US12141004B2

公开(公告)日：2024-11-12

申请号：US17532416

申请日：2021-11-22

Applicant: Google LLC

Inventor： Jerry Chiu ,  Evan Fraisse

IPC: H05K7/20 ,  G06F1/20 ,  H05K7/18

Abstract: A cage for containing a liquid immersible computer hardware component includes a base portion and two elongate portions extending in a depth direction from the base portion. The elongate portions define a socket adjacent to the base portion in the depth direction and between the elongate portions in a lateral direction. The base portion defines a depth extension below the socket in the depth direction and the elongate portions define lateral extensions on either side of the socket. The cage also includes a power adaptor for conveying power from an intake at an outer edge of the cage to the component when the component is received in the socket.

公开(公告)号：US20230161391A1

公开(公告)日：2023-05-25

申请号：US17532147

申请日：2021-11-22

Applicant: Google LLC

Inventor： Jerry Chiu ,  Reza H. Khiabani ,  Xiaojin Wei ,  Madhusudan K. Iyengar

IPC: G06F1/20 ,  F28F1/00

CPC classification number: G06F1/20 ,  F28F1/00 ,  G06F2200/201 ,  F28F2210/02 ,  F28F2250/108

Abstract: A heat exchanger includes a first manifold having an inlet opening and a second manifold having an outlet opening. A group of conduits fluidly connect the first manifold and the second manifold to one another such that a flow path is established for liquid to flow from the inlet opening to the outlet opening. The flow path includes a select portion that extends through all conduits within the group of conduits. Valves are located in the first manifold and the second manifold. The valves are operable to change the select portion of the flow path from between a first state, wherein the conduits within group of conduits are fluidly connected in parallel with one another, and a second state, wherein the conduits within the group of conduits are fluidly connected in series with one another.

公开(公告)号：US10108073B2

公开(公告)日：2018-10-23

申请号：US15487136

申请日：2017-04-13

Applicant: Google LLC

Inventor： Jerry Chiu ,  Katherine Stoy ,  Li-Ping Wang

IPC: G03B17/55 ,  H04N5/247 ,  H01L27/146 ,  H04N5/225

Abstract: A heat transfer apparatus includes a circuit board assembly and an image sensor including a plurality of photodetectors disposed in a semiconductor material. The image sensor is mounted to the circuit board assembly. A thermal strap with a first end is thermally coupled to transfer heat out of the image sensor. A heat sink is thermally coupled to a second end of the thermal strap opposite the first end of the thermal strap to receive heat from the image sensor.

公开(公告)号：US20240284635A1

公开(公告)日：2024-08-22

申请号：US18636967

申请日：2024-04-16

Applicant: Google LLC

Inventor： Jerry Chiu ,  Madhusudan K. Iyengar

IPC: H05K7/20

CPC classification number: H05K7/203 ,  H05K7/20127 ,  H05K7/20318 ,  H05K7/20818

Abstract: A housing and cooling system for computer hardware includes an infrastructure module and a payload module. The infrastructure module is configured for housing computer hardware and is equipped with either or both of a convective air cooling system and an arrangement of metal plates connected by one or more conduits for carrying liquid for cooling computer equipment housed by the infrastructure module. The infrastructure modules also houses a programmable logic controller (“PLC”). The payload module includes an immersion cooling system governed by the PLC and is located outside of the infrastructure module.

公开(公告)号：US20230164951A1

公开(公告)日：2023-05-25

申请号：US17532031

申请日：2021-11-22

Applicant: Google LLC

Inventor： Jerry Chiu ,  Madhusudan K. Iyengar

IPC: H05K7/20

CPC classification number: H05K7/203 ,  H05K7/20818 ,  H05K7/20318 ,  H05K7/20127

Abstract: A housing and cooling system for computer hardware includes an infrastructure module and a payload module. The infrastructure module is configured for housing computer hardware and is equipped with either or both of a convective air cooling system and an arrangement of metal plates connected by one or more conduits for carrying liquid for cooling computer equipment housed by the infrastructure module. The infrastructure modules also houses a programmable logic controller (“PLC”). The payload module includes an immersion cooling system governed by the PLC and is located outside of the infrastructure module.

公开(公告)号：US20210068309A1

公开(公告)日：2021-03-04

申请号：US17095554

申请日：2020-11-11

Applicant: Google LLC

Inventor： Jerry Chiu ,  Skyler Salman ,  Madhusudan Krishnan Iyengar

IPC: H05K7/20

Abstract: Systems and methods for data center liquid cooling apparatus provisioning are described. In some aspects, such systems and methods may provision one or more data center liquid cooling apparatus, e.g., prior to such apparatus being put into service to a data center to cool data center devices, such as server trays (and more specifically, heat-generating devices such as processors, memories, voltage regulators, and other devices mounted on motherboards of the server trays). In some aspects, such liquid cooling apparatus include cold plates or evaporators that are mounted in thermal communication with the heat generating devices (in the server trays) and utilize a flow of a cooling liquid (e.g., water, glycol, refrigerant) to remove heat from the server tray (e.g., with or without a phase change of the cooling liquid).