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公开(公告)号：US20200057477A1
公开(公告)日：2020-02-20
申请号：US16103265
申请日：2018-08-14
Applicant: Google LLC
Inventor： James Cooper , Kenneth Ryan Loo , Igor Markovsky
Abstract: Techniques of managing heat within an electronic device include providing a vapor chamber as an external surface of an electronic device. For example, when the electronic device includes a thin notebook computer (e.g., an “ultrabook”), the vapor chamber may be, in its entirety or at least a part of, the d-case (i.e., the bottom cover or exterior surface of the laptop, opposite the keyboard and/or trackpad when the notebook computer is open). Such a vapor chamber may be very thin (as thin as 0.3 mm), while being about 50% more stiff and 50× more thermally conductive as aluminum, which may be used as the d-case in conventional notebook computers.
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