Modular data center serverhall assembly

    公开(公告)号:US11324146B2

    公开(公告)日:2022-05-03

    申请号:US16919270

    申请日:2020-07-02

    Applicant: Google LLC

    Abstract: A kit for forming a data center comprising a first rack, a second rack, a first support having a first end and a second end opposite the first end, the first support configured to be secured to the floor at the first end, a cooling frame having a cooling unit received therein, the cooling frame having a first face and a second face opposite the first face, the cooling frame configured to be secured to the second end of the first support, a first distribution frame having a first plurality of support arms extending therefrom, the first distribution frame configured to be coupled to the first face of the cooling frame, and a second distribution frame having a second plurality of support arms extending therefrom, the second distribution frame configured to be coupled to the second face of the cooling frame.

    Modular Data Center Serverhall Assembly

    公开(公告)号:US20220007547A1

    公开(公告)日:2022-01-06

    申请号:US16919270

    申请日:2020-07-02

    Applicant: Google LLC

    Abstract: A kit for forming a data center comprising a first rack, a second rack, a first support having a first end and a second end opposite the first end, the first support configured to be secured to the floor at the first end, a cooling frame having a cooling unit received therein, the cooling frame having a first face and a second face opposite the first face, the cooling frame configured to be secured to the second end of the first support, a first distribution frame having a first plurality of support arms extending therefrom, the first distribution frame configured to be coupled to the first face of the cooling frame, and a second distribution frame having a second plurality of support arms extending therefrom, the second distribution frame configured to be coupled to the second face of the cooling frame.

Patent Agency Ranking