公开(公告)号：US20230114118A1

公开(公告)日：2023-04-13

申请号：US17551513

申请日：2021-12-15

Applicant: Google LLC

Inventor： Yuan Jen Chang ,  Ronald Trinidad

IPC: H05K1/02 ,  H05K1/11 ,  H01L27/06 ,  H01L25/065 ,  H05K3/46

Abstract: A cavity printed circuit board (PCB) that allows electronic components with different dimensions disposed therein is provided. A cavity with a desired dimension is formed in the cavity PCB where the electronic components may be mounted and soldered therein. The cavity formed in the cavity PCB may also provide additional flexibility regarding placements and locations where the electronic components may be disposed in the 3D vertical stacking and packaging of the IC devices so as to provide alternatives of using different types of wiring or interconnection structures or fine-pitch connection lines among the electronic components.

公开(公告)号：US11963296B2

公开(公告)日：2024-04-16

申请号：US17551513

申请日：2021-12-15

Applicant: Google LLC

Inventor： Yuan Jen Chang ,  Ronald Trinidad

IPC: H05K1/02 ,  H01L25/065 ,  H01L27/06 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K1/0284 ,  H01L25/0652 ,  H01L27/0688 ,  H05K1/113 ,  H05K3/4697

Abstract: A cavity printed circuit board (PCB) that allows electronic components with different dimensions disposed therein is provided. A cavity with a desired dimension is formed in the cavity PCB where the electronic components may be mounted and soldered therein. The cavity formed in the cavity PCB may also provide additional flexibility regarding placements and locations where the electronic components may be disposed in the 3D vertical stacking and packaging of the IC devices so as to provide alternatives of using different types of wiring or interconnection structures or fine-pitch connection lines among the electronic components.