公开(公告)号：US20230319979A1

公开(公告)日：2023-10-05

申请号：US18331627

申请日：2023-06-08

Applicant: Google LLC

Inventor： Yau-Shing Lee ,  Rolando Willcox Esparza ,  George Liu ,  Wing Tung Wong ,  Frédéric Heckmann ,  Vivian W. Tang

IPC: H05K1/02 ,  H05K7/14 ,  H05K7/20

CPC classification number: H05K1/023 ,  H05K1/0203 ,  H05K7/1417 ,  H05K7/2039 ,  H01Q5/307

Abstract: This document describes an access point device and associated systems and methods. The techniques and systems include an access point device that includes a housing with an antenna carrier, a circuit board assembly, a heat sink, and a heat shield positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally cylindrical vertical wall via rounded corners. The antenna carrier supports multiple antennas positioned proximate to an inner surface of the vertical wall. The heat sink is positioned between the antenna carrier and the circuit board assembly. The circuit board assembly is positioned between the heat shield and the heat sink, and the heat shield is positioned between the circuit board assembly and the bottom housing member.

公开(公告)号：US20220061128A1

公开(公告)日：2022-02-24

申请号：US17520545

申请日：2021-11-05

Applicant: Google LLC

Inventor： Yau-Shing Lee ,  Rolando Willcox Esparza ,  George Liu ,  Wing Tung Wong ,  Frédéric Heckmann ,  Vivian W. Tang

IPC: H04W88/08 ,  H01Q5/307 ,  H05K1/02 ,  H05K7/14 ,  H05K7/20

Abstract: This document describes an access point device and associated systems and methods. The techniques and systems include an access point device that includes a housing with an antenna carrier, a circuit board assembly, a heat sink, and a heat shield positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally cylindrical vertical wall via rounded corners. The antenna carrier supports multiple antennas positioned proximate to an inner surface of the vertical wall. The heat sink is positioned between the antenna carrier and the circuit board assembly. The circuit board assembly is positioned between the heat shield and the heat sink, and the heat shield is positioned between the circuit board assembly and the bottom housing member.

公开(公告)号：US20210100065A1

公开(公告)日：2021-04-01

申请号：US17001563

申请日：2020-08-24

Applicant: Google LLC

Inventor： Yau-Shing Lee ,  Rolando Willcox Esparza ,  George Liu ,  Wing Tung Wong ,  Frédéric Heckmann ,  Vivian W. Tang

IPC: H04W88/08 ,  H05K1/02 ,  H05K7/20 ,  H05K7/14 ,  H01Q5/307

Abstract: This document describes an access point device and associated systems and methods. The techniques and systems include an access point device that includes a housing with an antenna carrier, a circuit board assembly, a heat sink, and a heat shield positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally cylindrical vertical wall via rounded corners. The antenna carrier supports multiple antennas positioned proximate to an inner surface of the vertical wall. The heat sink is positioned between the antenna carrier and the circuit board assembly. The circuit board assembly is positioned between the heat shield and the heat sink, and the heat shield is positioned between the circuit board assembly and the bottom housing member.

公开(公告)号：US11744007B2

公开(公告)日：2023-08-29

申请号：US17520545

申请日：2021-11-05

Applicant: Google LLC

Inventor： Yau-Shing Lee ,  Rolando Willcox Esparza ,  George Liu ,  Wing Tung Wong ,  Frédéric Heckmann ,  Vivian W. Tang

IPC: H05K1/02 ,  H05K7/14 ,  H05K7/20 ,  H01Q5/307 ,  H04W88/08 ,  H04W88/16

CPC classification number: H05K1/023 ,  H05K1/0203 ,  H05K7/1417 ,  H05K7/2039 ,  H01Q5/307 ,  H04W88/08 ,  H04W88/16 ,  H05K2201/10098 ,  H05K2201/10106

Abstract: This document describes an access point device and associated systems and methods. The techniques and systems include an access point device that includes a housing with an antenna carrier, a circuit board assembly, a heat sink, and a heat shield positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally cylindrical vertical wall via rounded corners. The antenna carrier supports multiple antennas positioned proximate to an inner surface of the vertical wall. The heat sink is positioned between the antenna carrier and the circuit board assembly. The circuit board assembly is positioned between the heat shield and the heat sink, and the heat shield is positioned between the circuit board assembly and the bottom housing member.

公开(公告)号：US11202341B2

公开(公告)日：2021-12-14

申请号：US17001563

申请日：2020-08-24

Applicant: Google LLC

Inventor： Yau-Shing Lee ,  Rolando Willcox Esparza ,  George Liu ,  Wing Tung Wong ,  Frédéric Heckmann ,  Vivian W. Tang

IPC: H04W88/08 ,  H01Q5/307 ,  H05K1/02 ,  H05K7/14 ,  H05K7/20 ,  H04W88/16

Abstract: This document describes an access point device and associated systems and methods. The techniques and systems include an access point device that includes a housing with an antenna carrier, a circuit board assembly, a heat sink, and a heat shield positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally cylindrical vertical wall via rounded corners. The antenna carrier supports multiple antennas positioned proximate to an inner surface of the vertical wall. The heat sink is positioned between the antenna carrier and the circuit board assembly. The circuit board assembly is positioned between the heat shield and the heat sink, and the heat shield is positioned between the circuit board assembly and the bottom housing member.