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公开(公告)号:US12018377B2
公开(公告)日:2024-06-25
申请号:US16975564
申请日:2019-02-26
CPC分类号: C23C18/34 , C23C18/1662
摘要: A metalizing bath for an electroless plating system includes a metal ion source, a reducing agent, insoluble particulate matter, and stabilizing components, wherein the stabilizing components comprise at least one anionic surfactant and at least one cationic surfactant.