公开(公告)号：US20230091814A1

公开(公告)日：2023-03-23

申请号：US17478176

申请日：2021-09-17

Applicant: Green Revolution Cooling, Inc.

Inventor： Derek GORDON ,  John BEAN, JR. ,  Jerry MAYFIELD ,  Clay BAKER

IPC: H05K7/20

Abstract: Various aspects include devices, systems, and methods for cooling a heatsink of electronic equipment immersed in an immersion coolant tank with a coolant shroud. The coolant shroud includes side walls and a covering wall. The side walls mounted on a mounting surface within the immersion coolant tank and on which the heatsink is secured and at least one of the side walls includes a fluid port. The covering wall extends from and between the side walls, wherein the side walls and the covering wall together form a cooling chamber that receives the heatsink. The covering wall includes a fluid aperture separate from the fluid port, wherein dielectric fluid inside the cooling chamber is in fluid communication with dielectric fluid outside the cooling chamber via the fluid aperture. The fluid port is in fluid communication with a dielectric fluid pump disposed outside the cooling chamber.

公开(公告)号：US20240090169A1

公开(公告)日：2024-03-14

申请号：US18244681

申请日：2023-09-11

Applicant: Green Revolution Cooling, Inc.

Inventor： John BEAN, JR. ,  Paul DIERKES ,  Shiraz GULRAIZ

IPC: H05K7/20

CPC classification number: H05K7/20272 ,  H05K7/20236 ,  H05K7/20263 ,  H05K7/20781

Abstract: An immersion cooling system is configured for uniform fluid distribution across computing devices and includes a tank defining an open interior volume, a distribution pipe having a plurality of ports, a distribution plate having a pattern of holes is positioned over the distribution pipe. A siphon wall divides the open interior volume into a first chamber and a second chamber, and the distribution plate and the distribution pipe are in the first chamber. The dielectric cooling fluid enters the first chamber of the tank through the plurality of ports in the distribution pipe, and flows through the pattern of holes in the distribution plate to contact the at least one computing device. The heat dissipates from the at least one computing device into the dielectric cooling fluid, which flows through the siphon wall into the second chamber via a transfer port that is located below a dielectric cooling fluid surface.

公开(公告)号：US20230302469A1

公开(公告)日：2023-09-28

申请号：US17705494

申请日：2022-03-28

Applicant: Green Revolution Cooling, Inc.

Inventor： John BEAN, JR.

IPC: B05B1/16 ,  H05K7/20

CPC classification number: B05B1/1663 ,  B05B1/1672 ,  H05K7/20236 ,  H05K7/20272 ,  H05K7/20772

Abstract: Various aspects include devices, systems, and methods for cooling electronic equipment immersed in an immersion coolant tank with a fluid delivery wand. The fluid delivery wand may include a coolant conduit and an aperture cover. The coolant conduit may extend from a support base of the immersion coolant tank. The coolant conduit may include a lumen configured to receive dielectric fluid, wherein the coolant conduit includes at least one conduit aperture extending through a sidewall of the coolant conduit. The aperture cover may be in sliding engagement with an outer surface of the sidewall of the coolant conduit. The aperture cover may be configured to selectively restrict flow of dielectric fluid through the at least one conduit aperture by sliding along the outer surface of the outer of the sidewall.