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1.发明授权公开(公告)号：US11203543B1
公开(公告)日：2021-12-21
申请号：US17245276
申请日：2021-04-30
IPC分类号： C02F9/00 , B01D21/26 , B01D29/11 , B01D61/02 , C02F11/14 , C02F101/12 , C02F1/42 , C02F11/125 , C02F1/66 , C02F1/00 , C02F101/30 , C02F103/16 , C02F1/52 , C02F1/28 , C02F103/34 , C02F103/04 , C02F1/44 , C02F1/78 , C02F1/04 , C02F1/469 , C02F1/32 , C02F11/13
摘要： A method, system and composition is described for treating waste generated from manufacturing operations including at least one of Printed Circuit Boards Fabrication (PCB FAB), General Metal Finishing (GMF), semiconductors manufacturing, chemical milling, and Physical Vapour Deposition (PVD). The method, system and composition are used to create zero liquid discharge recycling.
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2.发明授权公开(公告)号：US11021384B1
公开(公告)日：2021-06-01
申请号：US17120124
申请日：2020-12-12
IPC分类号： B01D29/11 , B01D61/02 , C02F1/00 , C02F1/04 , C02F1/32 , C02F1/42 , C02F1/44 , C02F1/469 , C02F1/78 , C02F103/04 , B01D21/26 , C02F9/00 , C02F1/28 , C02F1/52 , C02F1/66 , C02F101/12 , C02F101/30 , C02F103/16 , C02F103/34 , C02F11/125 , C02F11/13 , C02F11/14
摘要： A method and system is provided for treating waste generated from manufacturing operations including at least one of Printed Circuit Boards Fabrication (PCB FAB), General Metal Finishing (GMF), semiconductors manufacturing, chemical milling, and Physical Vapour Deposition (PVD). The method and system are used to create zero liquid discharge recycling.
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公开(公告)号：US11597668B2
公开(公告)日：2023-03-07
申请号：US17520682
申请日：2021-11-07
IPC分类号： B01D21/26 , B01D29/11 , B01D61/02 , C02F1/00 , C02F1/04 , C02F1/42 , C02F1/44 , C02F1/66 , C02F103/04 , C02F103/16 , C02F103/34 , C02F9/00 , C02F1/28 , C02F1/32 , C02F1/469 , C02F1/52 , C02F1/78 , C02F101/12 , C02F101/30 , C02F11/125 , C02F11/13 , C02F11/14
摘要： A method and system is provided for treating waste generated from manufacturing operations including at least one of Printed Circuit Boards Fabrication (PCB FAB), General Metal Finishing (GMF), semiconductors manufacturing, chemical milling, and Physical Vapour Deposition (PVD). The method and system are used to create zero liquid discharge recycling.
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公开(公告)号：US20220348487A1
公开(公告)日：2022-11-03
申请号：US17520682
申请日：2021-11-07
摘要： A method and system is provided for treating waste generated from manufacturing operations including at least one of Printed Circuit Boards Fabrication (PCB FAB), General Metal Finishing (GMF), semiconductors manufacturing, chemical milling, and Physical Vapour Deposition (PVD). The method and system are used to create zero liquid discharge recycling.
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5.发明授权公开(公告)号：US11203544B1
公开(公告)日：2021-12-21
申请号：US17245333
申请日：2021-04-30
IPC分类号： C02F9/00 , B01D21/26 , B01D29/11 , B01D61/02 , C02F11/14 , C02F101/12 , C02F1/42 , C02F11/125 , C02F1/66 , C02F1/00 , C02F101/30 , C02F103/16 , C02F1/52 , C02F1/28 , C02F103/34 , C02F103/04 , C02F1/44 , C02F1/78 , C02F1/04 , C02F1/469 , C02F1/32 , C02F11/13
摘要： A method, system and composition is described for treating waste generated from manufacturing operations including at least one of Printed Circuit Boards Fabrication (PCB FAB), General Metal Finishing (GMF), semiconductors manufacturing, chemical milling, and Physical Vapour Deposition (PVD). The method, system and composition are used to create zero liquid discharge recycling.
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