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公开(公告)号:US11362476B2
公开(公告)日:2022-06-14
申请号:US17105136
申请日:2020-11-25
发明人: Siyang Cheng , Peijin Wang , Xiaoyu Wang , Qian Cheng
IPC分类号: H01S3/042 , H01S5/024 , F21V29/503 , F21V29/504 , F21V29/56 , H01S3/0941 , H01S5/40 , H01S3/02 , H01S5/023 , H01S5/0233 , H01S5/0235 , H01S5/02325 , F21V29/508 , F21V5/04 , H01S3/04 , H01S5/02212 , H01S5/02 , H01S3/06 , H01S3/07 , H01S3/109 , F21Y115/30 , F21Y105/10
摘要: A system includes a heat sink module and a driving circuit module. The heat sink module includes stepped through-holes that each includes a cylindrical upper and lower portions connected by a ring-shaped surface. The bottom surface of the heat sink module includes grooves that respectively pass through the lower portions of respective sequences of the stepped through-holes. The driving circuit module includes conductive connectors and electrical driving surfaces that are disposed external to the heat sink module. Each conductive connector lies within a respective groove in the bottom surface of the heat sink module. The conductive connectors include internal connectors that each link at least two stepped through-holes in a respective sequence of stepped through-holes passed by a respective groove, and include external connectors that each link at least one stepped through-hole in the respective sequence of stepped through-holes to the electrical driving surfaces.