Wafer Scanning
    1.
    发明申请
    Wafer Scanning 审中-公开
    晶圆扫描

    公开(公告)号:US20100012855A1

    公开(公告)日:2010-01-21

    申请号:US11921354

    申请日:2006-06-02

    IPC分类号: G01N21/00

    CPC分类号: G01N21/9501 H01L21/67288

    摘要: A semiconductor wafer measuring device including a wafer mover adapted to move a semiconductor wafer; a measurement head adapted to scan a surface of the semiconductor wafer as the semiconductor wafer is moved by the wafer mover; and a controller. The controller is adapted to control movement of the wafer mover to provide a first scanning segment of a first portion of the surface of the semiconductor wafer without rotating the semiconductor wafer during the first scanning segment, a second scanning segment of a second different portion of the surface of the semiconductor wafer without rotating the semiconductor wafer during the second scanning segment; and rotating the semiconductor wafer between the first and second scanning segments.

    摘要翻译: 一种半导体晶片测量装置,包括适于移动半导体晶片的晶片移动器; 测量头,其适于在晶片移动器移动半导体晶片时扫描半导体晶片的表面; 和控制器。 控制器适于控制晶片移动器的运动,以在半导体晶片的表面的第一部分提供第一扫描段,而不在第一扫描段期间旋转半导体晶片,第二扫描段的第二不同部分 在第二扫描段期间不使半导体晶片旋转的半导体晶片的表面; 以及在第一和第二扫描段之间旋转半导体晶片。