Procedure for the preparation of borders of chip-board panels to be
covered subsequently
    1.
    发明授权
    Procedure for the preparation of borders of chip-board panels to be covered subsequently 失效
    准备将要覆盖的芯片板的边框的程序

    公开(公告)号:US5433806A

    公开(公告)日:1995-07-18

    申请号:US91998

    申请日:1993-07-15

    IPC分类号: B27N7/00 B32B31/16 B27F1/00

    摘要: Improved procedure for the preparation of borders of elements in wood particles, particularly for the formation of small doors, and panels so obtained, characterized by the fact of:being firstly milled lengthwise in correspondence to at least one of the four external sides, said milling consisting of a groove that concerns only the intermediate zone formed by an agglomeration of large chip particles:being spread with glue in the interior of said sites so obtained;finally, proceeding with the insertion inside the site of an insert of wood, pseudo wood or plastic material, conforming to the same section:then the said panel so obtained could be subjected to a finishing cycle essentially including, firstly the shaping of the borders concerned and lastly conveniently covering with melamine paper, PVC, laminates and derivatives.

    摘要翻译: 用于制备木质颗粒中的元素边界,特别是形成小门的改进方法以及如此获得的面板,其特征在于:首先根据四个外侧中的至少一个纵向铣削铣削 包括仅涉及由大片状颗粒的聚集形成的中间区的凹槽:在如此获得的所述位点的内部用胶铺展; 最后,在符合同一部分的木材,假木材或塑料材料插入件的现场内进行插入,然后如此获得的所述面板可以进行整理循环,基本上包括:首先对相关边框进行成形 最后方便地覆盖三聚氰胺纸,PVC,层压板和衍生物。