Methods of forming a flexible circuit board
    2.
    发明申请
    Methods of forming a flexible circuit board 审中-公开
    形成柔性电路板的方法

    公开(公告)号:US20070206364A1

    公开(公告)日:2007-09-06

    申请号:US11366834

    申请日:2006-03-02

    IPC分类号: H05K7/00 H05K1/18

    摘要: A method for forming a flexible circuit board includes placing an adhesive coated coverlay over a flexible media, placing a release film over the adhesive coated coverlay and compressing together the flexible media, the adhesive coated coverlay, and the release film. The flexible media includes circuitry. The release film includes a multi-layer film having first and second layers. The first layer includes an elastomer and the second layer includes a fluoropolymer.

    摘要翻译: 一种用于形成柔性电路板的方法包括将粘合剂涂覆的覆盖物放置在柔性介质上,将剥离膜放置在粘合剂涂覆的覆盖物上并将柔性介质,粘合剂涂覆的覆盖物和释放膜压缩在一起。 柔性介质包括电路。 剥离膜包括具有第一层和第二层的多层膜。 第一层包括弹性体,第二层包括含氟聚合物。