公开(公告)号：US20090325469A1

公开(公告)日：2009-12-31

申请号：US12273829

申请日：2008-11-19

申请人： Gyo-Woog KOO ,  Chang-Ro Yoon ,  Jung-Gun Cho ,  Ki-Hoon Choi ,  Jung-Bong Choi ,  Duk-Hyun Son ,  Se-Hun Goo

发明人： Gyo-Woog KOO ,  Chang-Ro Yoon ,  Jung-Gun Cho ,  Ki-Hoon Choi ,  Jung-Bong Choi ,  Duk-Hyun Son ,  Se-Hun Goo

IPC分类号： B24B1/00 ,  B24B7/04 ,  B24B41/06

CPC分类号： B24B37/30 ,  H01L21/6838 ,  H01L21/68728 ,  H01L21/68742

摘要： Provided are a substrate supporting unit and a single type substrate polishing apparatus using the substrate supporting unit. During a polishing process, the bottom surface of a substrate is attached to the substrate supporting unit by vacuum suction, and during a post-cleaning process, the substrate is supported by the substrate supporting unit at a position spaced apart from the substrate supporting unit for cleaning the bottom surface of the substrate. Therefore, according to the substrate supporting unit and the substrate polishing apparatus using the substrate supporting unit, in a state where the substrate is supported by the single type substrate supporting unit, a process for polishing the top surface of the substrate and a post-process for cleaning the top and bottom surfaces of the substrate can be sequentially performed.

摘要翻译： 提供了一种基板支撑单元和使用该基板支撑单元的单一基板抛光装置。 在抛光过程中，通过真空抽吸将衬底的底表面附接到衬底支撑单元，并且在后清洗过程中，衬底由衬底支撑单元支撑在与衬底支撑单元间隔开的位置，用于 清洁基底的底面。 因此，根据基板支撑单元和使用基板支撑单元的基板研磨装置，在基板由单一基板支撑单元支撑的状态下，对基板的顶面进行研磨的工序和后处理 可以依次执行用于清洁基板的顶表面和底表面的清洁。