Damage resistant photomask construction
    1.
    发明授权
    Damage resistant photomask construction 失效
    耐损伤的光掩模结构

    公开(公告)号:US06841309B1

    公开(公告)日:2005-01-11

    申请号:US10044076

    申请日:2002-01-11

    IPC分类号: G03F1/14 G03F9/00

    CPC分类号: G03F1/48

    摘要: A method for fabricating a damage resistant photomask includes forming a photomask pattern on a substrate and forming a transparent, protective coating on the photomask pattern. The protective coating may be an electrical insulator (e.g., spin-on glass). In addition, an antireflective layer may be applied to the protective coating. A pellicle may also be attached over the protective coating. The protective coating may prevent electrostatic energy from forming on or arcing between features on the photomask pattern and damaging the features. The protective layer may also prevent the photomask pattern from being damaged by or reacting with other substances, such as cleaning solutions.

    摘要翻译: 制造耐损伤光掩模的方法包括在基片上形成光掩模图案,并在光掩模图案上形成透明保护涂层。 保护涂层可以是电绝缘体(例如旋涂玻璃)。 此外,可以将抗反射层施加到保护涂层。 防护薄膜也可以附着在保护涂层上。 保护涂层可以防止静电能量在光掩模图案上的特征之间形成或电弧,并损坏特征。 保护层也可以防止光掩模图案被其他物质如清洁溶液损坏或与其反应。

    Dust cover comprising anti-reflective coating
    2.
    发明授权
    Dust cover comprising anti-reflective coating 有权
    防尘罩包括防反射涂层

    公开(公告)号:US06280885B1

    公开(公告)日:2001-08-28

    申请号:US09371823

    申请日:1999-08-11

    申请人: Joseph S. Gordon

    发明人: Joseph S. Gordon

    IPC分类号: G03F900

    CPC分类号: G03F1/62

    摘要: A dust cover having a film with an inorganic, anti-reflective coating and method for use during semiconductor fabrication. The dust cover is primarily for use during photolithography. The dust cover may include an amorphous fluoropolymer film having an inorganic, anti-reflective coating attached to a frame. The inorganic, anti-reflective coating preferably has a refractive index below 1.4.

    摘要翻译: 具有无机,抗反射涂层的膜和在半导体制造期间使用的方法的防尘罩。 防尘罩主要用于光刻。 防尘罩可以包括具有附着到框架的无机防反射涂层的无定形含氟聚合物膜。 无机抗反射涂层的折射率优选低于1.4。

    Dust cover for use in semiconductor fabrication
    3.
    发明授权
    Dust cover for use in semiconductor fabrication 有权
    用于半导体制造的防尘罩

    公开(公告)号:US06582859B2

    公开(公告)日:2003-06-24

    申请号:US09772777

    申请日:2001-01-30

    申请人: Joseph S. Gordon

    发明人: Joseph S. Gordon

    IPC分类号: G03F900

    CPC分类号: G03F1/62

    摘要: A dust cover having a film with an inorganic, anti-reflective coating and method for use during semiconductor fabrication. The dust cover is primarily for use during photolithography. The dust cover may include an amorphous fluoropolymer film having an inorganic, anti-reflective coating attached to a frame. The inorganic, anti-reflective coating preferably has a refractive index below 1.4.

    摘要翻译: 具有无机,抗反射涂层的膜和在半导体制造期间使用的方法的防尘罩。 防尘罩主要用于光刻。 防尘罩可以包括具有附着到框架的无机防反射涂层的无定形含氟聚合物膜。 无机抗反射涂层的折射率优选低于1.4。

    Method for constructing a photomask assembly using an encoded mark
    4.
    发明授权
    Method for constructing a photomask assembly using an encoded mark 失效
    使用编码标记构造光掩模组件的方法

    公开(公告)号:US06894766B1

    公开(公告)日:2005-05-17

    申请号:US10106605

    申请日:2002-03-26

    IPC分类号: G03B27/62 G03F1/14

    CPC分类号: G03F1/64 G03F1/38

    摘要: A method for constructing a photomask assembly using an encoded mark is disclosed. The method includes comparing a first encoded mark located on a photomask with a second encoded mark located on a pellicle. The first encoded mark includes one or more first symbols and the second encoded mark includes one or more second symbols. The method further includes mounting the pellicle on the photomask if at least one of the symbols of the first encoded mark matches at least one of the symbols of the second encoded mark.

    摘要翻译: 公开了一种使用编码标记构造光掩模组件的方法。 该方法包括将位于光掩模上的第一编码标记与位于防护薄膜上的第二编码标记进行比较。 第一编码标记包括一个或多个第一符号,第二编码标记包括一个或多个第二符号。 该方法还包括如果第一编码标记中的至少一个符号与第二编码标记的符号中的至少一个匹配,则将防护薄膜组件安装在光掩模上。

    Method for using a coated fluoropolymer substrate pellicle in semiconductor fabrication
    5.
    发明授权
    Method for using a coated fluoropolymer substrate pellicle in semiconductor fabrication 有权
    在半导体制造中使用涂覆的氟聚合物基底防护薄膜的方法

    公开(公告)号:US06586159B2

    公开(公告)日:2003-07-01

    申请号:US09772774

    申请日:2001-01-30

    申请人: Joseph S. Gordon

    发明人: Joseph S. Gordon

    IPC分类号: G03C500

    CPC分类号: G03F1/62

    摘要: A dust cover having a film with an inorganic, anti-reflective coating and method for use during semiconductor fabrication. The dust cover is primarily for use during photolithography. The dust cover may include an amorphous fluoropolymer film having an inorganic, anti-reflective coating attached to a frame. The inorganic, anti-reflective coating preferably has a refractive index below 1.4.

    摘要翻译: 具有无机,抗反射涂层的膜和在半导体制造期间使用的方法的防尘罩。 防尘罩主要用于光刻。 防尘罩可以包括具有附着到框架的无机防反射涂层的无定形含氟聚合物膜。 无机抗反射涂层的折射率优选低于1.4。