公开(公告)号：US20190221498A1

公开(公告)日：2019-07-18

申请号：US16323090

申请日：2016-10-06

Applicant: HEWLETT PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： KUAN-TING WU ,  DAVID A. PIPHO ,  KEVIN VOSS

IPC: H01L23/433 ,  H01L21/48

CPC classification number: H01L23/433 ,  H01L21/4871 ,  H01L21/56 ,  H01L23/02 ,  H01L23/3675 ,  H01L23/42 ,  H01L2224/32245 ,  H01L2924/14 ,  H01L2924/16251

Abstract: In one example, an apparatus is described, which includes an electronic component, a thermal dissipation unit, a thermal interface material disposed between the electronic component and the thermal dissipation unit, and an adhesive sealant applied around the thermal interface material between the electronic component and the thermal dissipation unit.