公开(公告)号：US20190008031A1

公开(公告)日：2019-01-03

申请号：US16065435

申请日：2016-01-28

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Vincent NGUYEN ,  Sung Hsia KUO ,  Ho M LAI

IPC: H05K1/02 ,  H05K3/12 ,  H05K1/18 ,  H05K1/11

Abstract: An example method includes linking a transmit line and receive line to a respective via, and printing two paths to each via, wherein each path is interrupted by two pairs of contacts. When a first resistor is in a first pair of contacts at a receive via, first signal is formed between a receive point of a first connector and the receive line. When a first capacitor is in first pair of contacts at a transmit via, second signal is formed between transmit point of first connector and the transmit line. When a second resistor is in second pair of contacts at receive via, third signal is formed between receive point of a second connector and the receive line. When a second capacitor is in second pair of contacts at transmit via, fourth signal is formed between a transmit point of second connector and the transmit line.