公开(公告)号：US20170265334A1

公开(公告)日：2017-09-14

申请号：US15329574

申请日：2014-08-29

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Joseph Anthony OLIVER ,  Kelly K SMITH ,  Keith A SAUER ,  James Jeffery SCHULZE

IPC: H05K7/20 ,  F04D29/60 ,  F04D29/40 ,  G06F1/20 ,  F04D25/16

Abstract: Example implementations relate to a fan module assembly. One example fan module assembly includes a basepan housed in a chassis of a computing device. The basepan includes a distal end. The fan module assembly also includes a plurality of pins extending from the basepan. The plurality of pins includes a first pin and a second pin. The first pin and the second pin are staggered with respect to a plane defined by the distal end. The fan module assembly further includes a fan module attached to the basepan via the first pin and the second pin.