公开(公告)号：US20170214162A1

公开(公告)日：2017-07-27

申请号：US15329474

申请日：2014-07-31

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Chin-Lung CHIANG ,  Jyun-Jie WANG ,  Meng-Chen WU ,  Raghavan V VENUGOPAL ,  Patrick RAYMOND ,  Andrew POTTER

IPC: H01R12/72 ,  H01R13/24 ,  H01R12/71

CPC classification number: H01R12/721 ,  H01R12/716 ,  H01R13/2457

Abstract: A Next Generation Form Factor (NGFF) connector apparatus can include a plurality of upper signal pins and an upper ground (GND) pin that is longer than other upper pins. The NGFF connector apparatus can also include a plurality of lower signal pins and a lower power (PWR) pin that is longer than other lower pins.