公开(公告)号：US20210194826A1

公开(公告)日：2021-06-24

申请号：US16723351

申请日：2019-12-20

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Nilashis Dey ,  John M. Lenthall ,  David A. Selvidge ,  Minh Nguyen

IPC: H04L12/947 ,  H04L12/935 ,  H04L12/933

Abstract: Switches and groups of IO ports, conventionally integrated on a single shared PCB, may be divided into separate switch modules and IO modules that can be connected by high-speed low-loss management cables in a variety of configurations. Thereafter, the separate modules may be replaced independently of each other. Some of the management connections may be parallel, similar to production-data connections. Alternatively, a series of IO modules (e.g., a chain or a ring) may be managed by a single switch module using a management method. The management method may include collecting and updating configuration and status information specific to each of the IO modules and, by extension, each of their IO ports. This enables the switch module to recognize, and thereafter ignore, unconnected ports, removing the performance penalty that sometimes arises when fewer than all available ports are connected. It also allows the switch module to rapidly adjust to addition, subtraction, and replacement of connected IO modules.

公开(公告)号：US11509079B2

公开(公告)日：2022-11-22

申请号：US16841594

申请日：2020-04-06

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Pinche Tsai ,  Minh Nguyen ,  David A. Selvidge

IPC: H01R12/00 ,  H01R12/70 ,  H01R13/15 ,  H05K7/14 ,  H05K1/18

Abstract: Blind mate connection techniques and associated connectors are disclosed. Blind mate connectors provide connections where visual inspection at time of connection may not be available. Stacking tolerance increases when connectors have a different set of datums (e.g., a different relative orientation) relative to adjacent connectors. Different datums permit twinning two printed circuit boards (“PCBs”) prior to insertion into a slot of a chassis. Each connector may be attached to a respective PCB utilizing a spring and offset feature to provide a standoff on a respective PCB. Control of standoff and rotational movement (e.g., via brackets) allows each individual connector to have a “float” for improved insertion tolerance. Connector pairs may connect through an opening in a midplane while simultaneously connecting to the midplane. Switch trays and node trays may be inserted through opposing sides of a chassis and be connected through the midplane of that chassis.

公开(公告)号：US20210313720A1

公开(公告)日：2021-10-07

申请号：US16841594

申请日：2020-04-06

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Pinche Tsai ,  Minh Nguyen ,  David A. Selvidge

IPC: H01R12/70 ,  H01R13/15 ,  H05K7/14 ,  H05K1/18

Abstract: Blind mate connection techniques and associated connectors are disclosed. Blind mate connectors provide connections where visual inspection at time of connection may not be available. Stacking tolerance increases when connectors have a different set of datums (e.g., a different relative orientation) relative to adjacent connectors. Different datums permit twinning two printed circuit boards (“PCBs”) prior to insertion into a slot of a chassis. Each connector may be attached to a respective PCB utilizing a spring and offset feature to provide a standoff on a respective PCB. Control of standoff and rotational movement (e.g., via brackets) allows each individual connector to have a “float” for improved insertion tolerance. Connector pairs may connect through an opening in a midplane while simultaneously connecting to the midplane. Switch trays and node trays may be inserted through opposing sides of a chassis and be connected through the midplane of that chassis.

公开(公告)号：US10602640B1

公开(公告)日：2020-03-24

申请号：US16190596

申请日：2018-11-14

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Pinche Tsai ,  Minh Nguyen ,  David A. Selvidge

IPC: H05K7/20 ,  G06F1/20

Abstract: In example implementations, a memory cooler is provided. The memory cooler includes a body. The body includes two pieces that are moveable relative to one another. Each piece of the body includes an inlet manifold, an outlet manifold, and a plurality of cold plates extending between the inlet manifold and the outlet manifold. The inlet manifold is to receive liquid coolant from a liquid coolant supply line. The outlet manifold is to return the liquid coolant to the liquid coolant supply line. The liquid coolant flows from the inlet manifold to the outlet manifold through interior channels of the cold plates. The plurality of cold plates of a first piece of the body are interleaved with the plurality of cold plates of a second piece of the body such that slots to receive memory modules are defined between adjacent pairs of cold plates.

公开(公告)号：US11102149B2

公开(公告)日：2021-08-24

申请号：US16723351

申请日：2019-12-20

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Nilashis Dey ,  John M. Lenthall ,  David A. Selvidge ,  Minh Nguyen

IPC: H04L12/947 ,  H04L12/933 ,  H04L12/935

Abstract: Switches and groups of IO ports may be divided into separate switch modules and IO modules that can be connected by high-speed low-loss management cables in a variety of configurations. Thereafter, the separate modules may be replaced independently of each other. The switch module may recognize, and thereafter ignore, unconnected ports, removing the performance penalty that sometimes arises when fewer than all available ports are connected. The switch module may rapidly adjust to addition, subtraction, and replacement of connected IO modules.