公开(公告)号：US20190077082A1

公开(公告)日：2019-03-14

申请号：US16088605

申请日：2017-02-27

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Anna TORRENT ,  Cristian FERRIS ROIG ,  Pau MARTIN VIDAL ,  Alex RUIS LAORDEN

IPC: B29C64/321 ,  B29C64/393

Abstract: A storage module of a 3D printing system is disclosed, such module comprising a plurality of transducers located at different sensing positions within the storage module being the plurality of transducers connected to a processor; wherein a combined signal of the plurality of temperature transducers is determined and the processor is to correlate the combined signal to an amount of build material inside the storage module