公开(公告)号：US10588225B2

公开(公告)日：2020-03-10

申请号：US16076502

申请日：2017-01-23

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Arthur Lin ,  Chienchih Chiu ,  Ken Tsai ,  Chiacheng Wei

IPC: H05K5/02 ,  G06F1/16 ,  B32B7/04 ,  G05B19/4093 ,  H05K5/00 ,  H05K5/04

Abstract: In one example, a casing of an electronic device is disclosed which includes a metallic housing and a moldable material. The metallic housing may have a first surface and a second surface opposite to the first surface. The first surface may include an undercut physically contacting the second surface. The moldable material may be insert molded in the undercut of the metallic housing.