公开(公告)号：US20220119971A1

公开(公告)日：2022-04-21

申请号：US17425146

申请日：2019-05-09

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Chi Hao Chang ,  Chienchih Chiu

IPC: C25D1/14 ,  C25D13/20 ,  C25D13/02 ,  H01M50/124

Abstract: In one example, a method for manufacturing an electronic device housing is described. A coating layer may be formed on a surface of a metal substrate. Further, an edge region of the metal substrate may be chamfered by applying water-based anti-corrosion cutting fluid to form an exposed surface portion of the metal substrate. On the exposed surface portion, a transparent protective passivation layer may be formed. Furthermore, a first electrophoretic deposition layer may be formed on the transparent protective passivation layer.

公开(公告)号：US10768672B2

公开(公告)日：2020-09-08

申请号：US16074455

申请日：2016-10-07

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Yu-Chen So ,  Chienchih Chiu ,  Chih-Hsiung Liao ,  Lien-Chia Chiu

IPC: G06F1/16

Abstract: In example implementations, a hinge is provided. The hinge comprises a first hinge plate having at least one opening, where the first hinge plate is coupled to a system cover via at least one fastener fitted through the at least one opening. The hinge comprises a second hinge plate movably coupled to the first hinge plate, where the second hinge plate comprises a tab member that is coupled to a display cover via an insert molding process. The hinge comprises a hinge cap to enclose a portion of the first hinge plate and the second hinge plate that are movable coupled.

公开(公告)号：US10588225B2

公开(公告)日：2020-03-10

申请号：US16076502

申请日：2017-01-23

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Arthur Lin ,  Chienchih Chiu ,  Ken Tsai ,  Chiacheng Wei

IPC: H05K5/02 ,  G06F1/16 ,  B32B7/04 ,  G05B19/4093 ,  H05K5/00 ,  H05K5/04

Abstract: In one example, a casing of an electronic device is disclosed which includes a metallic housing and a moldable material. The metallic housing may have a first surface and a second surface opposite to the first surface. The first surface may include an undercut physically contacting the second surface. The moldable material may be insert molded in the undercut of the metallic housing.

公开(公告)号：US10543657B2

公开(公告)日：2020-01-28

申请号：US16067729

申请日：2016-04-05

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Hsiu-Pen Lin ,  Kun-Cheng Tsai ,  Chienchih Chiu

IPC: B32B3/06 ,  B32B15/08 ,  B29C45/00 ,  B29C45/14 ,  B29C45/16 ,  G06F1/16 ,  H05K5/02

Abstract: In one example, a housing for an electronic device may be disclosed which may include a first multi-layer structure. The first multi-layer structure may include a first layer and a second layer formed on the first layer. Each of the first layer and the second layer may include a plurality of protruding features and a plurality of recessing features on an edge of the first layer and the second layer. At least one of the plurality of recessing features of one layer may intersect at least one of the plurality of protruding features of other layer.