公开(公告)号：US20220278454A1

公开(公告)日：2022-09-01

申请号：US17748835

申请日：2022-05-19

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chin-Hung MA ,  Chien-Pai LAI ,  Chih Hung CHIEN

IPC: H01Q5/40 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/48 ,  H01Q13/10 ,  H01Q21/06

Abstract: An example radio frequency (RF) front-end module is described, which may include a printed circuit board (PCB) including a ground plane, an RF integrated circuit (RFIC) including RF components mounted on the PCB, and an antenna array on the PCB. The antenna array may operate at a first resonant frequency in a wireless communication network. Further, the RF front-end module may include a slot defined in the ground plane to provide a second resonant frequency in the wireless communication network. The second resonant frequency is lower than the first resonant frequency.