公开(公告)号：US20230135341A1

公开(公告)日：2023-05-04

申请号：US17512893

申请日：2021-10-28

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Wen Yen Tang ,  Cheng-Han Tsai ,  Chong-Wei Wu ,  Wen Hua Ni

IPC: H01R33/97 ,  H05K7/12

Abstract: An example printed circuit board includes: a fixed portion disposed on the printed circuit board, the fixed portion defining a first end of a card slot to receive a card on the printed circuit board; a support bracket to be installed on the printed circuit board, the support bracket including a retaining portion to retain the card in the card slot, the retaining portion defining a second end of the card slot; and wherein the support bracket is orientable in one of: (i) a first orientation to define a first length of the card slot between the fixed portion and the retaining portion and (ii) a second orientation to define a second length of the card slot between the fixed portion and the retaining portion.

公开(公告)号：US20220129039A1

公开(公告)日：2022-04-28

申请号：US17293213

申请日：2019-07-11

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Cheng-Han Tsai ,  Kuan-Ting Wu ,  Chong-Wei Wu ,  Hung-Wei Wu

IPC: G06F1/16 ,  B29C45/14

Abstract: In one example, an electronic device housing may include a metal substrate defining an opening and a shock absorber in-mold molded with the metal substrate. Further, shock absorber may include a supporting portion formed on a surface of the metal substrate and a protruding portion that extends from the supporting portion through the opening. Further, the electronic device housing may include a metal layer disposed on the supporting portion.