公开(公告)号：US11031319B2

公开(公告)日：2021-06-08

申请号：US16323090

申请日：2016-10-06

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kuan-Ting Wu ,  David A Pipho ,  Kevin Voss

IPC: H01L23/433 ,  H01L21/56 ,  H01L23/02 ,  H01L23/42 ,  H01L21/48 ,  H01L23/367

Abstract: In one example, an apparatus is described, which includes an electronic component, a thermal dissipation unit, a thermal interface material disposed between the electronic component and the thermal dissipation unit, and an adhesive sealant applied around the thermal interface material between the electronic component and the thermal dissipation unit.