公开(公告)号：US11877414B2

公开(公告)日：2024-01-16

申请号：US17451282

申请日：2021-10-18

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Bradford Adam Gill ,  Tony Seokhwa Moon ,  Derek Lee Goode

IPC: H05K7/14 ,  H05K7/12 ,  G06F1/18 ,  H01R13/639 ,  H01R12/72 ,  H05K1/14

CPC classification number: H05K7/1417 ,  G06F1/185 ,  H01R12/721 ,  H01R13/639 ,  H05K1/141 ,  H05K1/144 ,  H05K7/12

Abstract: In some examples, a tool-less electronic component retention apparatus includes a bracket to affix to a circuit board, and a spring-loaded arm attached to the bracket. The spring-loaded arm has an engagement tab that is angled downwardly to engage an upper surface of an electronic component to mount the electronic component to the circuit board. The spring-loaded arm is pivotable between an engaged position and a release position by a user without use of a tool.

公开(公告)号：US20230121074A1

公开(公告)日：2023-04-20

申请号：US17451282

申请日：2021-10-18

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Bradford Adam Gill ,  Tony Seokhwa Moon ,  Derek Lee Goode

IPC: H05K7/14 ,  H05K7/12 ,  H01R12/72 ,  H01R13/639 ,  G06F1/18

Abstract: In some examples, a tool-less electronic component retention apparatus includes a bracket to affix to a circuit board, and a spring-loaded arm attached to the bracket. The spring-loaded arm has an engagement tab that is angled downwardly to engage an upper surface of an electronic component to mount the electronic component to the circuit board. The spring-loaded arm is pivotable between an engaged position and a release position by a user without use of a tool.