公开(公告)号：US20210213729A1

公开(公告)日：2021-07-15

申请号：US16772978

申请日：2019-02-06

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： John ROSSI ,  Eric D. NESS ,  James Michael GARDNER ,  Scott A. LINN

IPC: B41J2/045

Abstract: An integrated circuit includes thermal tracking logic, control logic, and an output interface. The thermal tracking logic determines a temperature of a fluid ejection die. The control logic defines an emulated parameter of the fluid ejection die as a function of the temperature of the fluid ejection die. The output interface outputs the emulated parameter to a printer system based on the function and the temperature of the fluid ejection die.