公开(公告)号：US10543657B2

公开(公告)日：2020-01-28

申请号：US16067729

申请日：2016-04-05

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Hsiu-Pen Lin ,  Kun-Cheng Tsai ,  Chienchih Chiu

IPC: B32B3/06 ,  B32B15/08 ,  B29C45/00 ,  B29C45/14 ,  B29C45/16 ,  G06F1/16 ,  H05K5/02

Abstract: In one example, a housing for an electronic device may be disclosed which may include a first multi-layer structure. The first multi-layer structure may include a first layer and a second layer formed on the first layer. Each of the first layer and the second layer may include a plurality of protruding features and a plurality of recessing features on an edge of the first layer and the second layer. At least one of the plurality of recessing features of one layer may intersect at least one of the plurality of protruding features of other layer.