公开(公告)号：US11309229B2

公开(公告)日：2022-04-19

申请号：US16617956

申请日：2017-07-13

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kuan-Ting Wu ,  Jamal Wakil ,  Davis Castillo

IPC: H01L23/373 ,  C09D7/61 ,  C09D7/20 ,  C09D133/08 ,  C09D167/00 ,  C09D169/00 ,  C09D175/04 ,  C08K3/04 ,  C08K3/08

Abstract: Described herein in some examples is a heat dissipation coating composition for an electronic device, which can comprise: a transparent coating layer deposited on a surface of the electronic device, wherein the coating layer comprises: a heat absorber selected from the group consisting of silica aerogel, carbon nanotubes, carbon nanotube aerogel, graphene, graphene aerogel, and combinations thereof, a transparent resin selected from the group consisting of a polyacrylic resin, a polycarbonate resin, a cyclic olefin resin, an epoxy resin, a urethane resin, a silicone resin, a cyanoacrylate resin, a polyester resin, and combinations thereof, and a solvent; and a heat spreader layer deposited at least partially on top of the transparent coating layer or deposited on the surface of the electronic device adjacent to the transparent coating layer, wherein the heat spreader layer comprises: metallic or non-metallic particles selected from the group consisting of copper, aluminum, graphite, carbon nanotube, graphene on a metal, graphene, and combinations thereof.