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公开(公告)号：US11446943B2
公开(公告)日：2022-09-20
申请号：US16491822
申请日：2017-10-10
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Emilio Carlos Cano , Macia Sole Pons , Jeffrey L Thielman
IPC: B41J29/377 , B41J2/045
Abstract: An example system includes an inlet, a guide structure, a heat exchange device and an outlet. In that example the heat exchange device is in thermal contact with the guide structure to change the temperature of print material. The print material may act on the temperature of a print head die while guided through the print head die.
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