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公开(公告)号:US11446943B2
公开(公告)日:2022-09-20
申请号:US16491822
申请日:2017-10-10
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Emilio Carlos Cano , Macia Sole Pons , Jeffrey L Thielman
IPC: B41J29/377 , B41J2/045
Abstract: An example system includes an inlet, a guide structure, a heat exchange device and an outlet. In that example the heat exchange device is in thermal contact with the guide structure to change the temperature of print material. The print material may act on the temperature of a print head die while guided through the print head die.
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公开(公告)号:US11731363B2
公开(公告)日:2023-08-22
申请号:US16071197
申请日:2016-05-12
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Emilio Carlos Cano , Ignacio Alejandre , Esteve Comas
IPC: B29C64/364 , B29C64/393 , B29C64/25 , B33Y40/00 , B33Y10/00 , B33Y30/00 , B33Y50/02
CPC classification number: B29C64/364 , B29C64/25 , B29C64/393 , B33Y40/00 , B33Y10/00 , B33Y30/00 , B33Y50/02
Abstract: In one example, an additive manufacturing system. An unsealed air supply enclosure for clean air is maintained at a first pressure above an ambient air pressure to inhibit unfiltered ambient air from leaking into the enclosure. An unsealed processing chamber is maintained at a second pressure below the ambient air pressure to inhibit processing chamber air from leaking out of the processing chamber. An air pathway is disposed between the air supply enclosure and the processing chamber to provide clean air from the air supply enclosure to the processing chamber.
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公开(公告)号:US20190263051A1
公开(公告)日:2019-08-29
申请号:US16317783
申请日:2016-10-19
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Salvador Sanchez Ribes , Hector Lebron , Juan J Hernandez , Emilio Carlos Cano
IPC: B29C64/106 , B29C35/16 , B29C64/205 , F28D1/02 , F28D1/06 , B29C64/264
Abstract: An apparatus and method for generating a three-dimensional object. The apparatus includes a build material area, at least one agent distributor with a fluid reservoir to store fluid agent and at least one fluid ejection die to selectively eject fluid agent in the build material area. A cooling system to remove heat from the at least one fluid ejection die has a heat sink. The at least one fluid ejection die is in thermal contact with the heat sink via the fluid agent of the fluid reservoir.
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公开(公告)号:US11220057B2
公开(公告)日:2022-01-11
申请号:US16071167
申请日:2016-05-12
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Emilio Carlos Cano , Oriol Borrell Carbonell , Salvador Sanchez Ribes
IPC: B29C64/35 , B33Y10/00 , B33Y30/00 , B33Y40/00 , B29C64/214 , B29C64/165
Abstract: Examples Include apparatuses and methods for generating three-dimensional objects. An example apparatus comprises an agent distributor and a wiping element disposed at a service location. The apparatus further comprises at least one airflow component disposed proximate the service location to generate airflow across the wiping element to reduce build material collection on the wiping element.
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公开(公告)号:US20190118421A1
公开(公告)日:2019-04-25
申请号:US16094734
申请日:2016-05-12
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Emilio Carlos Cano , Ignacio Alejandre , Esteve Comas
IPC: B29C35/16 , B29C64/165 , B29C64/295
Abstract: In some examples, a lamp assembly for a printing system includes a heating lamp to generate heat in an active region of the printing system, and a housing comprising an inner chamber containing the heating lamp, an airflow inlet to receive a cooling airflow for provision into the inner chamber of the housing to cool the heating lamp, and a plurality of exhaust holes through which heated exhaust air is to exit from the inner chamber of the housing, the plurality of exhaust holes formed in a wall of the housing. The lamp assembly further includes an attachment element to attach the lamp assembly to a carriage of the printing system.
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公开(公告)号:US20210170686A1
公开(公告)日:2021-06-10
申请号:US16071167
申请日:2016-05-12
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Emilio Carlos Cano , Oriol Borrell Carbonell , Salvador Sanchez Ribes
IPC: B29C64/35 , B29C64/165 , B29C64/214 , B33Y10/00 , B33Y30/00 , B33Y40/00
Abstract: Examples Include apparatuses and methods for generating three-dimensional objects. An example apparatus comprises an agent distributor and a wiping element disposed at a service location. The apparatus further comprises at least one airflow component disposed proximate the service location to generate airflow across the wiping element to reduce build material collection on the wiping element.
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公开(公告)号:US11014286B2
公开(公告)日:2021-05-25
申请号:US16317783
申请日:2016-10-19
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Salvador Sanchez Ribes , Hector Lebron , Juan J Hernandez , Emilio Carlos Cano
IPC: B29C64/106 , B29C64/264 , B29C64/205 , B29C35/16 , F28D1/02 , F28D1/06 , B29C64/209 , B29C64/165 , B33Y10/00 , B33Y30/00 , B33Y40/00 , B29C64/20 , B29C64/255
Abstract: An apparatus and method for generating a three-dimensional object. The apparatus includes a build material area, at least one agent distributor with a fluid reservoir to store fluid agent and at least one fluid ejection die to selectively eject fluid agent in the build material area. A cooling system to remove heat from the at least one fluid ejection die has a heat sink. The at least one fluid ejection die is in thermal contact with the heat sink via the fluid agent of the fluid reservoir.
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公开(公告)号:US20210138810A1
公开(公告)日:2021-05-13
申请号:US16491822
申请日:2017-10-10
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Emilio Carlos Cano , Macia Sole Pons , Jeffrey L. Thielman
IPC: B41J29/377 , B41J2/045
Abstract: An example system includes an inlet, a guide structure, a heat exchange device and an outlet. In that example the heat exchange device is in thermal contact with the guide structure to change the temperature of print material. The print material may act on the temperature of a print head die while guided through the print head die.
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公开(公告)号:US20210221058A1
公开(公告)日:2021-07-22
申请号:US16095781
申请日:2016-07-01
Applicant: Emilio Carlos CANO , Ignacio ALEJANDRE , Oriol BORRELL CARBONELL , Pamela Carolina ZALDUMBIDE SALAVERRIA , Oriol ROIG , HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Emilio Carlos Cano , Ignacio Alejandre , Oriol Borrell Carbonell , Pamela Carolina Zaldumbide Salaverria , Oriol Roig
IPC: B29C64/25 , B29C64/264 , B33Y30/00 , B33Y10/00
Abstract: Certain examples described herein relate to printer (110, 210) cooling systems of three-dimensional (3D) printers. In an example of a printer (110, 210) cooling system of a three-dimensional (3D) printer (110, 210), a shared air flow volume (120, 220) is for cooling a plurality of internal printer components (130, 140, 230, 240), and a single air inlet (150, 245) delivers ambient air (160) from outside the three-dimensional (3D) printer (110, 210) to the shared air flow volume (120, 220) In certain cases, the shared air flow volume (120, 220) comprises a first air flow conduit (135, 270) for cooling a first internal printer component (130, 230) and a second air flow conduit (145, 275) for cooling a second internal printer component (140, 240). In certain examples, the first and the second air flow conduits (135, 270) are arranged at least partially in parallel.
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公开(公告)号:US20210170687A1
公开(公告)日:2021-06-10
申请号:US16071197
申请日:2016-05-12
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Emilio Carlos Cano , Ignacio Alejandre , Esteve Comas
IPC: B29C64/364 , B29C64/393 , B29C64/25
Abstract: In one example, an additive manufacturing system. An unsealed air supply enclosure for clean air is maintained at a first pressure above an ambient air pressure to inhibit unfiltered ambient air from leaking into the enclosure. An unsealed processing chamber is maintained at a second pressure below the ambient air pressure to inhibit processing chamber air from leaking out of the processing chamber. An air pathway is disposed between the air supply enclosure and the processing chamber to provide clean air from the air supply enclosure to the processing chamber.
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