公开(公告)号：US20150131940A1

公开(公告)日：2015-05-14

申请号：US14390587

申请日：2012-04-16

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Paul Kessler Rosenberg ,  Michael Renne Ty Tan ,  Sagi Varghese Mathai ,  Joseph Straznicky

IPC: G02B6/12 ,  H01L21/02 ,  G02B6/42

CPC classification number: G02B6/12 ,  G02B6/424 ,  G02B6/4245 ,  G02B6/425 ,  G02B6/4259 ,  G02B6/4274 ,  G02B6/4279 ,  G02B6/4295 ,  H01L21/02 ,  Y10T29/41

Abstract: An optical subassembly includes a thru optical via (104) formed through a semiconductor substrate (102), an optoelectronic component (108) secured to the substrate (102) such that an active region (106) of the optoelectronic component is aligned with the thru optical via (104), and circuitry (110) formed into the substrate (102), the circuitry to connect to and operate in accordance with the optoelectronic component (108).

Abstract translation: 光学子组件包括通过半导体衬底（102）形成的通过光通路（104），固定到衬底（102）的光电子部件（108），使得光电子部件的有源区域（106）与通孔 光通孔（104）以及形成到基板（102）中的电路（110），该电路连接到并根据光电子元件（108）操作。