公开(公告)号：US20240329329A1

公开(公告)日：2024-10-03

申请号：US18129765

申请日：2023-03-31

申请人： XILINX, INC.

发明人： Gamal REFAI-AHMED ,  Chuan Xie ,  Chi-Yi Chao ,  Suresh Ramalingam ,  Nagadeven Karunakaran ,  Ferdinand F. Fernandez

IPC分类号： G02B6/38 ,  G02B6/42

CPC分类号： G02B6/3849 ,  G02B6/381 ,  G02B6/4295

摘要： A method of fabricating a chip package is provided, and a chip package fabricated using the same are provided. The method includes connecting a photonic die to a substrate of the chip package and attaching a protection apparatus to the substrate. The method also includes attaching a photonic connector to the photonic die. At least a portion of the photonic connector is disposed inside a housing of the protection apparatus. A fabrication process is performed on the chip package while the photonic connector is inside the housing. After processing, the photonic connector is removed from the housing.

公开(公告)号：US12083353B2

公开(公告)日：2024-09-10

申请号：US17724343

申请日：2022-04-19

申请人： IPG Photonics Corporation

发明人： Gregory Altshuler ,  Christopher Gaal ,  Valery Kozlov

IPC分类号： A61N5/06 ,  G02B6/36 ,  G02B6/38 ,  G02B6/42 ,  A61B18/22 ,  A61N5/067

CPC分类号： A61N5/06 ,  G02B6/3624 ,  G02B6/3861 ,  G02B6/3882 ,  G02B6/3893 ,  G02B6/3897 ,  G02B6/4206 ,  G02B6/4292 ,  G02B6/4295 ,  A61B18/22 ,  A61N2005/063 ,  A61N2005/0632 ,  A61N5/067 ,  G02B6/3887

摘要： A delivery system extends from a laser radiation source for connecting to a medical device that utilizes the laser radiation for medical treatment. The delivery system comprises an optical fiber connecting to a male launch connecter. The male launch connector having a body portion with the optical fiber fixed or constrained therein and the optical fiber terminating at a male ferrule with a forward directed fiber facet, the male ferrule may be cantilevered within the body portion by the optical fiber line providing freedom of movement of the male ferrule. The launch connector engages a receiving connector on the medical device first with mechanical connection portions and then more finely aligning optical connection portions by the male ferrule self aligning in a female ferrule with cooperating tapered surfaces. The male portion may fully seat in the female portion with cooperating cylindrical surfaces.

公开(公告)号：US12072543B1

公开(公告)日：2024-08-27

申请号：US18060145

申请日：2022-11-30

申请人： Meta Platforms Technologies, LLC

发明人： Pasqual Rivera

IPC分类号： G02B6/42 ,  F21V8/00 ,  G02B27/01 ,  H01L31/054 ,  H01L31/18

CPC分类号： G02B6/4295 ,  G02B6/0083 ,  G02B27/0172 ,  H01L31/054 ,  H01L31/18

摘要： A waveguide display includes a waveguide configured to transport display light visible to human eyes, a coupler formed on a broadside surface of the waveguide and configured to couple portions of the display light out of the waveguide at one or more regions of the waveguide, and a photovoltaic device at an edge of the waveguide, the photovoltaic device configured to convert at least a portion of the display light that reaches the edge of the waveguide into electrical power.

公开(公告)号：US20240280768A1

公开(公告)日：2024-08-22

申请号：US18437260

申请日：2024-02-09

申请人： SHUNYUN TECHNOLOGY (ZHONGSHAN) Limited

发明人： Jie Huang

IPC分类号： G02B6/42

CPC分类号： G02B6/4244 ,  G02B6/4214 ,  G02B6/424 ,  G02B6/4245 ,  G02B6/428 ,  G02B6/4295

摘要： A 400G silicon photonic integrated optical module with a photoelectric integrated substrate includes a printed circuit board (PCB) substrate, a fiber array, a detector assembly, and a laser assembly, where the fiber array, the detector assembly and the laser assembly are mounted on a surface of the PCB substrate; a recessed groove is formed in the surface of the PCB substrate; a silicon substrate is attached in the recessed groove; optical waveguides are arranged in the silicon substrate in parallel; a surface circuit board is further mounted at an upper side of the silicon substrate; a first microlens and a second microlens are further provided in the recessed groove; and an optical transmission path is formed between a fiber port of the fiber array, the first microlens, the optical waveguide, the second microlens, and the detector assembly or the laser assembly.

公开(公告)号：US11726276B1

公开(公告)日：2023-08-15

申请号：US17391167

申请日：2021-08-02

申请人： National Technology & Engineering Solutions of Sandia, LLC ,  The Texas A&M University System

发明人： Michael Wood ,  Alejandro J. Grine ,  Darwin K. Serkland ,  Bryan James Kaehr ,  Andrew E. Hollowell ,  Gregory M. Peake ,  Alexander Ruyack ,  Sam Palermo

IPC分类号： G02B6/42 ,  G02B6/43 ,  H04B10/40 ,  G02B6/293 ,  H04B10/50

CPC分类号： G02B6/4215 ,  G02B6/2934 ,  G02B6/4249 ,  G02B6/4295 ,  G02B6/43 ,  H04B10/40 ,  H04B10/503 ,  B81B2201/045

摘要： A photonics transceiver is described herein, wherein the photonics transceiver exhibits improved areal bandwidth density and improved energy per bit consumption relative to conventional photonics transceivers. The photonics transceiver achieves an areal bandwidth density of at least 5 Tbps/mm2 with an energy consumption of less than 500 fJ/bit (sum of energy consumed for both a transmitted bit and a received bit). The photonics transceiver is a multi-chip module, where chips in the multi-chip module are tightly integrated with one another. The multi-chip module includes light source, photodetector, photonics, and control/logic chips. The photonics chip includes transparent conducting oxide integrated optical modulators and multiplexers and demultiplexers based on MEMS-tunable optical ring resonators.

公开(公告)号：US20190064455A1

公开(公告)日：2019-02-28

申请号：US16108673

申请日：2018-08-22

申请人： FUJITSU COMPONENT LIMITED

发明人： Tatsuhiro Mori ,  Takeshi Okuyama

IPC分类号： G02B6/42 ,  G02B6/43

CPC分类号： G02B6/4206 ,  G02B6/4239 ,  G02B6/4245 ,  G02B6/4249 ,  G02B6/4257 ,  G02B6/428 ,  G02B6/4295 ,  G02B6/43

摘要： An optical module includes a lens sheet having at least one lens on one surface thereof, a substrate having at least one of a light emitter or a light receiver on one surface thereof, and an adhesive film configured to bond the lens sheet to the substrate, wherein a protrusion is formed on the lens sheet so as to surround the lens.

公开(公告)号：US20180302086A1

公开(公告)日：2018-10-18

申请号：US15488058

申请日：2017-04-14

申请人： Lawrence Livermore National Security, LLC

发明人： Stephen Sampayan

IPC分类号： H03K17/78 ,  G02B19/00 ,  H01L31/09 ,  H01L31/0232

CPC分类号： H01L31/0232 ,  G02B3/0006 ,  G02B6/4295 ,  G02B19/0028 ,  G02B19/0066 ,  H01L31/02327 ,  H01L31/09

摘要： A photonic device having wide bandgap (WBG) materials which change electrical behaviors in response to low-intensity light is disclosed. The device comprises an optical waveguide located in an optical path of light to receive the light and to spatially confine the received light as guided light at a higher optical intensity than the received light; a wide bandgap (WBG) material located in an optical path of the guided light output by the optical waveguide; and two electrodes formed at two different locations on the WBG material to provide two electrical contacts of an electrical path within the WBG material, wherein the WBG material exhibits an electrical conductivity that varies with a level of the guided light output by the optical waveguide to turn on or off the electrical path between the two electrodes.

公开(公告)号：US10078184B2

公开(公告)日：2018-09-18

申请号：US15272606

申请日：2016-09-22

申请人： SiFotonics Technologies Co., Ltd.

发明人： Tuo Shi ,  Shipeng Yan ,  Nai Zhang ,  Dong Pan

IPC分类号： G02B6/32 ,  G02B6/42 ,  G02B6/12 ,  G02B5/04 ,  G02B6/293 ,  G02B6/34 ,  G02B27/10

CPC分类号： G02B6/32 ,  G02B5/04 ,  G02B6/12019 ,  G02B6/29367 ,  G02B6/34 ,  G02B6/4203 ,  G02B6/4208 ,  G02B6/4214 ,  G02B6/4215 ,  G02B6/4249 ,  G02B6/4255 ,  G02B6/4257 ,  G02B6/4295 ,  G02B27/1006

摘要： An imprinting method for forming an integrated optical coupling device on wafer level may include: providing a substrate, with a reflection coating disposed thereon; providing an imprinting mold, with void regions shaped according to a designed lens profile; forming a molding material on the substrate; pressing the imprinting mold on the molding material on the substrate; curing the molding material into a cured molding material; removing the imprinting mold; depositing an anti-reflection film on the cured molding material; and dicing to form an integrated optical coupling device.

公开(公告)号：US20180252881A1

公开(公告)日：2018-09-06

申请号：US15909235

申请日：2018-03-01

申请人： SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.

发明人： Yoshihiro Yoneda ,  Ryuji Masuyama ,  Takuya Okimoto

IPC分类号： G02B6/42 ,  G02B6/26 ,  H01L31/0224 ,  H01L31/101 ,  H01L31/0232

CPC分类号： G02B6/4295 ,  G02B6/12004 ,  G02B6/26 ,  H01L31/022408 ,  H01L31/02327 ,  H01L31/03046 ,  H01L31/101 ,  H01L31/105 ,  H04B10/691

摘要： A functional optical device applicable to a coherent optical communication system as a front end device is disclosed. The functional optical device includes a pair of light-receiving elements of a type of waveguide photodiode (PD), a pair of signal pads, a pair of ground pads, a bias pad, and a substrate that monolithically integrates those elements thereon. The light-receiving elements generate a photocurrent complementary to each other in respective anodes thereof; while, receive biases through the bias pad common to the light-receiving elements. Those pads are disposed along an edge of the substrate such that the signal pads put the bias pads therebetween, and the ground pads put the signal pads and the bias pad therebetween.

公开(公告)号：US20180196210A1

公开(公告)日：2018-07-12

申请号：US15914981

申请日：2018-03-07

申请人： ROCKLEY PHOTONICS LIMITED

发明人： Andrew Rickman ,  Guomin Yu ,  Aaron Zilkie ,  Haydn F. Jones

IPC分类号： G02B6/43 ,  G02F1/025 ,  H04B10/40 ,  G02B6/42 ,  G02B6/12 ,  G02B6/35

CPC分类号： G02B6/43 ,  G02B6/12019 ,  G02B6/3548 ,  G02B6/356 ,  G02B6/4279 ,  G02B6/4295 ,  G02F1/025 ,  H04B10/40

摘要： An optical waveguide device comprising: one or more photonic chips, the one or more photonic chips including: a first portion of a photonic chip comprising an array of first components, each of the first components having an optical input and an electrical output; and a second portion of a photonic chip comprising an array of second components, each of the second components configured to receive an electrical input; the optical waveguide device further comprising: an integrated circuit; the integrated circuit forming an electrical bridge between the electrical outputs of the first components and respective electrical inputs of the second components; wherein the integrated circuit is directly mounted onto the one or more photonic chips; and/or wherein the integrated circuit is located between the first portion of a photonic chip and the second portion of a photonic chip.