公开(公告)号：US20210053361A1

公开(公告)日：2021-02-25

申请号：US16978488

申请日：2018-03-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Juan SAEZ GOMEZ ,  Michel GEORGES ENCRENAZ ,  Fernando CHICA AGUILERA

IPC: B41J2/21 ,  B41J29/393 ,  B41J2/045

Abstract: A first input color channel value for a first colorant and a second input color channel value for a second colorant are received. A first number of drops of a first colorant is obtained based on the first input color channel value and a first drop sequence. A second number of drops of a second colorant is obtained based on the second input color channel value and a second drop sequence. The first drop sequence defines a first mapping between input color channel values and number of drops and the second drop sequence defines a second, different, mapping between input color channel values and number of drops.

公开(公告)号：US20250001691A1

公开(公告)日：2025-01-02

申请号：US18701225

申请日：2021-10-25

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Sergio PUIGARDEU ARAMENDIA ,  Michel GEORGES ENCRENAZ ,  Marc GARCIA GRAU ,  Sergi CULUBRET I CORTADA

IPC: B29C64/364 ,  B22F10/47 ,  B22F10/80 ,  B22F12/70 ,  B28B1/00 ,  B28B17/00 ,  B28B17/04 ,  B29C64/165 ,  B29C64/386 ,  B33Y10/00 ,  B33Y50/00 ,  G06F30/17

Abstract: According to one aspect, there is provided a method of automatically creating sacrificial parts to be printed in the three-dimensional printer. The method comprises obtaining object model data relating to a three-dimensional object to be printed in a build chamber by a three-dimensional printer. The method determines whether the object will likely be deformed during a curing process of contents of the build chamber, wherein the curing process comprises heating of the contents of the build chamber and generating a gas flow. If the determination is affirmative, the method includes generating updated object model data including additional object to be printed in proximity to the object, the additional object to prevent deformation of the object due to the gas flow applied during the curing process.