公开(公告)号：US20220176629A1

公开(公告)日：2022-06-09

申请号：US17680661

申请日：2022-02-25

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Marius Valles ,  Pau Martin Vidal ,  Rafel Texido ,  Joan Mach

IPC: B29C64/245 ,  B33Y30/00 ,  B33Y40/00 ,  B29C64/321

Abstract: In example implementations, an apparatus includes a build platform and a cap. The build platform has an opening on a top surface to fill a build material storage unit. The cap is inserted into the opening to seal the opening. A top surface of the cap and the top surface of the build platform have a uniform thermal conductivity when the cap is inserted into the opening.

公开(公告)号：US20200290274A1

公开(公告)日：2020-09-17

申请号：US16084141

申请日：2016-05-12

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Marius Valles ,  Pau Martin Vidal ,  Rafel Texido ,  Joan Mach

IPC: B29C64/245 ,  B33Y30/00 ,  B33Y40/00 ,  B29C64/321

Abstract: In example implementations, an apparatus includes a build platform and a cap. The build platform has an opening on a top surface to fill a build material storage unit. The cap is inserted into the opening to seal the opening. A top surface of the cap and the top surface of the build platform have a uniform thermal conductivity when the cap is inserted into the opening.

公开(公告)号：US11642847B2

公开(公告)日：2023-05-09

申请号：US17680661

申请日：2022-02-25

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Marius Valles ,  Pau Martin Vidal ,  Rafel Texido ,  Joan Mach

IPC: B29C64/245 ,  B33Y30/00 ,  B33Y40/00 ,  B29C64/321

CPC classification number: B29C64/245 ,  B29C64/321 ,  B33Y30/00 ,  B33Y40/00

Abstract: In example implementations, an apparatus includes a build platform and a cap. The build platform has an opening on a top surface to fill a build material storage unit. The cap is inserted into the opening to seal the opening. A top surface of the cap and the top surface of the build platform have a uniform thermal conductivity when the cap is inserted into the opening.

公开(公告)号：US11285668B2

公开(公告)日：2022-03-29

申请号：US16084141

申请日：2016-05-12

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Marius Valles ,  Pau Martin Vidal ,  Rafel Texido ,  Joan Mach

IPC: B29C64/245 ,  B33Y30/00 ,  B33Y40/00 ,  B29C64/321

Abstract: In example implementations, an apparatus includes a build platform and a cap. The build platform has an opening on a top surface to fill a build material storage unit. The cap is inserted into the opening to seal the opening. A top surface of the cap and the top surface of the build platform have a uniform thermal conductivity when the cap is inserted into the opening.

公开(公告)号：US20190084235A1

公开(公告)日：2019-03-21

申请号：US16093913

申请日：2017-05-10

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Francesc Roure Pastor ,  Ismael Chanclon ,  Rafel Texido ,  Xavier Alonso

IPC: B29C64/336 ,  B29C64/314 ,  B29C64/153 ,  B29C64/357

Abstract: A mixer unit is described, comprising a support, a mixing container which includes a mixing device, and first and second load cells mounted on opposed sides of the mixing container between the mixing container and the support. The mixing container is to receive and mix unfused build materials for a 3D printing system from at least two different sources. The mixing container is mounted to the support in a manner constraining to vertical movement and such that all vertical forces from the mixing container pass through the load cells to the support. In this manner, a vertical force of the mixing container acting on the support is measured to weigh the contents of the mixing container. A method of mixing unfused build materials for a 3D printing system in a predefined weight ratio using the mixer unit is also described.