公开(公告)号：US11433670B2

公开(公告)日：2022-09-06

申请号：US16958607

申请日：2019-04-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Michael W Cumbie ,  Chien-Hua Chen ,  Randy Hoffman

IPC: B41J2/14 ,  B41J2/16

Abstract: An example fluidic device may comprise a fluidic die and a support element coupled to the fluidic die. A fluid channel may be arranged within the support element and may define a fluid path through the support element and a fluid aperture of the fluidic die. A conductive element may be arranged in the fluid path and be coupled to a ground of the fluidic die. A material and size of the conductive element may be selected to engender galvanic effect at an approximately zero potential.

公开(公告)号：US20210252858A1

公开(公告)日：2021-08-19

申请号：US16958607

申请日：2019-04-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Michael W Cumbie ,  Chien-Hua Chen ,  Randy Hoffman

IPC: B41J2/14 ,  B41J2/16

Abstract: An example fluidic device may comprise a fluidic die and a support element coupled to the fluidic die. A fluid channel may be arranged within the support element and may define a fluid path through the support element and a fluid aperture of the fluidic die. A conductive element may be arranged in the fluid path and be coupled to a ground of the fluidic die. A material and size of the conductive element may be selected to engender galvanic effect at an approximately zero potential.

公开(公告)号：US10328694B2

公开(公告)日：2019-06-25

申请号：US15556871

申请日：2015-07-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien Hua Chen ,  Diane R Hammerstad ,  Randy Hoffman

IPC: B41J2/14 ,  B41J2/16

Abstract: A printed circuit board includes a recessed pocket. A fluid droplet ejection die is within recessed pocket.

公开(公告)号：US11279130B2

公开(公告)日：2022-03-22

申请号：US16958578

申请日：2019-04-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Michael W Cumbie ,  David J Benson ,  Randy Hoffman ,  Amy Gault

IPC: B41J2/14 ,  B41J2/16

Abstract: Examples include a fluidic device comprising a fluidic die, a support element, and a conductive member. The support element is coupled to the fluidic die, and the support element has a fluid channel formed therein. The fluid channel exposes at least a portion of a back surface of the fluidic die. The support element further includes a member opening passing therethrough. The conductive member is connected to the fluidic die, and the conductive member is a least partially disposed in the member opening such that a portion of the conductive member is exposed to the fluid channel of the support element.

公开(公告)号：US20180170050A1

公开(公告)日：2018-06-21

申请号：US15556871

申请日：2015-07-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien Hua Chen ,  Diane R Hammerstad ,  Randy Hoffman

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/14072 ,  B41J2/14129 ,  B41J2/14145 ,  B41J2/1433 ,  B41J2/1623 ,  B41J2/1637 ,  B41J2002/14419 ,  B41J2002/14491 ,  B41J2202/13 ,  B41J2202/18

Abstract: A printed circuit board includes a recessed pocket. A fluid droplet ejection die is within recessed pocket.