公开(公告)号：US20170106651A1

公开(公告)日：2017-04-20

申请号：US15120676

申请日：2014-06-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Bradley D. Chung ,  Galen P. Cook ,  Michael H. Hayes ,  Adam L. Ghozeil ,  Chantelle Elizabeth Domingue ,  Valerie J. Marty ,  Anthony M. Fuller ,  Sterling Chaffins

IPC: B41J2/14 ,  B41J29/377

CPC classification number: B41J2/14129 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1631 ,  B41J29/377

Abstract: A fluid ejection structure can include thermal resistors, a substrate, layers on the substrate, wherein said layers can include a region proximate to the resistor that has reduced field oxide.

公开(公告)号：US20180039308A1

公开(公告)日：2018-02-08

申请号：US15546951

申请日：2015-04-20

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： David A. Moore ,  Kianoush Naeli ,  Valerie J. Marty ,  James McKinnell

IPC: G06F1/20 ,  H05K5/06 ,  H05K9/00 ,  H05K7/20

Abstract: An electronic device includes a housing enclosure, which at least sealingly contains an electronic component, a barrier, a pump, and a coolant. The electronic component is located on a substrate, while the barrier defines a circulation loop in which the coolant is exposed to the electronic component. The pump is positioned within the circulation loop to cause flow of the coolant through the circulation loop.

公开(公告)号：US09815282B2

公开(公告)日：2017-11-14

申请号：US15120676

申请日：2014-06-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Bradley D. Chung ,  Galen P. Cook ,  Michael H. Hayes ,  Adam L. Ghozeil ,  Chantelle Elizabeth Domingue ,  Valerie J. Marty ,  Anthony M. Fuller ,  Sterling Chaffins

IPC: B41J2/14 ,  B41J2/16 ,  B41J29/377

CPC classification number: B41J2/14129 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1631 ,  B41J29/377

Abstract: A fluid ejection structure can include thermal resistors, a substrate, layers on the substrate, wherein said layers can include a region proximate to the resistor that has reduced field oxide.

公开(公告)号：US10684662B2

公开(公告)日：2020-06-16

申请号：US15546951

申请日：2015-04-20

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： David A. Moore ,  Kianoush Naeli ,  Valerie J. Marty ,  James McKinnell

IPC: G06F1/20 ,  H05K5/06 ,  H05K7/20 ,  H05K9/00 ,  H01L23/473

Abstract: An electronic device includes a housing enclosure, which at least sealingly contains an electronic component, a barrier, a pump, and a coolant. The electronic component is located on a substrate, while the barrier defines a circulation loop in which the coolant is exposed to the electronic component. The pump is positioned within the circulation loop to cause flow of the coolant through the circulation loop along one side of the at least one barrier in one direction and along an opposite side of the at least one barrier in an opposite direction.