公开(公告)号：US20210202799A1

公开(公告)日：2021-07-01

申请号：US16076328

申请日：2017-07-18

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Ning GE ,  Ya-Ling CHANG ,  Helen A. HOLDER ,  Tyler SIMS

IPC: H01L33/40 ,  H01L25/075 ,  H01L33/62 ,  H01L33/00

Abstract: In some examples, a micro light-emitting diode (μLED) panel may include a μLED including at least two electrodes (or bond pads), and a ferromagnetic material included in the at least two electrodes (or bond pads) and/or disposed on the at least two electrodes (or bond pads). The μLED panel may further include a panel substrate including ferromagnetic material selectively disposed at least at two locations corresponding to locations of the at least two electrodes (or bond pads) to align a plurality of μLEDs including the μLED onto the panel substrate.