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公开(公告)号：US20210402782A1
公开(公告)日：2021-12-30
申请号：US16603821
申请日：2018-04-15
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, LP.
Inventor： Anthony M. Fuller , Michael W. Cumbie , Chien-Hua Chen
IPC: B41J2/175 , H01L23/544
Abstract: A circuit die may include an outermost circuit layer having electrical transmission routing and an alignment target overlying the outermost circuit layer.
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