公开(公告)号：US20170182786A1

公开(公告)日：2017-06-29

申请号：US15116026

申请日：2014-02-04

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, LP.

Inventor： Emilio Angulo Navarro ,  Josiah CHAN ,  Fernando Bayona Alcolea ,  Albert Crespi Serrano ,  Mikel Zuza Irurueta ,  Jorge Castano ,  Ying Ying HO

IPC: B41J2/175

CPC classification number: B41J2/17566 ,  B41J2/175 ,  B41J29/393 ,  B41J2002/17579

Abstract: An example device in accordance with an aspect of the present disclosure includes a sensor die having a sensitive region and a bond pad. A bond is formed between a wire and the bond pad of the sensor die. An encapsulant is to retain the wire at the bond pad and mechanically support the wire and the bond, based on covering the bond and wire according to an encapsulant height, extending from the bond pad, greater than a bond height. The encapsulant is localized at the bond pad of the sensor die to enable the sensitive region to remain uncovered by the encapsulant.