公开(公告)号：US20220348005A1

公开(公告)日：2022-11-03

申请号：US17863934

申请日：2022-07-13

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, LP.

Inventor： John ROSSI ,  Eric D. NESS ,  James Michael GARDNER ,  Scott A. LINN

IPC: B41J2/045

Abstract: An integrated circuit includes thermal tracking logic, control logic, and an output interface. The thermal tracking logic determines a temperature of a fluid ejection die. The control logic defines an emulated parameter of the fluid ejection die as a function of the temperature of the fluid ejection die. The output interface outputs the emulated parameter to a printer system based on the function and the temperature of the fluid ejection die.

公开(公告)号：US20210405946A1

公开(公告)日：2021-12-30

申请号：US16959397

申请日：2019-10-25

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, LP.

Inventor： James Michael GARDNER ,  Stephen D. PANSHIN

IPC: G06F3/12

Abstract: A logic circuitry package for a replaceable print apparatus component includes an interface including a power terminal and at least one logic circuit. The at least one logic circuit is configured to respond to communications sent to a first address via the interface and respond to communications sent to a second address via the interface. The at least one logic circuit is configured to in response to a first command sent to the first address, draw a first current on the power terminal; and in response to a hibernate command sent to the first address, respond to communications sent to the second address and draw a second current on the power terminal less than the first current.

公开(公告)号：US20210402788A1

公开(公告)日：2021-12-30

申请号：US16959383

申请日：2019-10-25

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY. LP.

Inventor： James Michael GARDNER ,  Frank D. DERRYBERRY ,  Sirena LU

IPC: B41J2/175

Abstract: A liquid level sensor package for a replaceable print liquid reservoir, the package including a substrate, a surface layer to contact a print liquid in the print liquid reservoir, and a layer stack including a number of metal layers disposed between the substrate and the surface layer. An array of heater elements disposed in one of the metal layers of the layer stack, and an array of thermal sensors disposed in a different one of the metal layers of the layer stack, each thermal sensor corresponding to a different heater element of the array of heater elements, and each thermal sensor to provide indication of a presence or absence of print liquid based on a sensed temperature after being heated by the corresponding heater element.