公开(公告)号：US12130483B2

公开(公告)日：2024-10-29

申请号：US17707879

申请日：2022-03-29

Applicant: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.

Inventor： Jianwei Yao ,  Benzheng Dong ,  Fabu Xu ,  Dongmei Yu ,  Fei Liu ,  Congwen Luo ,  Jianwei Mu

IPC: G02B6/42

CPC classification number: G02B6/4268 ,  G02B6/4206 ,  G02B6/4246 ,  G02B6/4269 ,  G02B6/428 ,  G02B6/4204

Abstract: This application discloses an optical module. A circuit board is provided with a first heat dissipation member. One end of the first heat dissipation member is attached with an optical chip, with a lens assembly covering the optical chip. The other end extends outwardly from a coverage region of the lens assembly, so that heat generated by the optical chip is diffused to outside of the lens assembly. One end of the first heat dissipation member away from the lens assembly is provided with a second heat dissipation member whose upper surface being provided with a thermally conductive member. An upper surface of the thermally conductive member is thermally coupled with an upper enclosure. The second heat dissipation member conducts the heat diffused by the first heat dissipation member to the upper enclosure via the thermally conductive member. Thus, heat dissipation is achieved via the upper enclosure.