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公开(公告)号：US12197021B2
公开(公告)日：2025-01-14
申请号：US18472563
申请日：2023-09-22
Inventor： Guangchao Du , Yongzheng Tang , Tao Wu , Jianwei Mu , Shaoshuai Sui , Jihong Han , Sitao Chen , Qian Shao , Bangyu Yu , Benzheng Dong , Xiangxun Sun , Fabu Xu
Abstract: An optical module includes a shell, a circuit board, a base, a laser assembly and a silicon optical chip. The laser assembly and the silicon optical chip are located on the base. The laser assembly includes an upper box, conductive substrates, laser chips and a light transmitting member. The upper box and the base are combined to provide a cavity. The cavity has an opening and a slot. The laser chips are located on the conductive substrates which are at least partially located in the cavity. The light transmitting member is disposed between the upper box and the base, and is configured to enclose the opening. Light exit surfaces of the laser chips are parallel to a light incident surface of the light transmitting member, and the light incident surface and a light exit surface of the light transmitting member are not parallel.
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公开(公告)号：US20250007608A1
公开(公告)日：2025-01-02
申请号：US18882203
申请日：2024-09-11
Inventor： Dan LI , Yifan XIE , Mengbo FU , Qinhao FU , Tengfei WANG , Feng CUI , Chuanbin LI , Zhanpeng ZHANG
Abstract: An optical module includes a base, a first cover, a circuit board, a light emitting assembly and a light receiving assembly. Part of the circuit board is arranged on a surface of the base, and part thereof arranged outside the base. The light emitting assembly includes a plurality of light-emitting chips disposed on the base and an optical multiplexer disposed on the first cover and located in a laser exit direction of the plurality of light-emitting chips. The light receiving assembly includes an optical demultiplexer disposed on the first cover, a plurality of light-receiving chips disposed on the circuit board and are located in a laser exit direction of the optical demultiplexer, a reflection prism disposed at a side of the plurality of light-receiving chips away from the circuit board, and an optical receiving case covering the plurality of light-receiving chips and the reflection prism.
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公开(公告)号：US12130483B2
公开(公告)日：2024-10-29
申请号：US17707879
申请日：2022-03-29
Inventor： Jianwei Yao , Benzheng Dong , Fabu Xu , Dongmei Yu , Fei Liu , Congwen Luo , Jianwei Mu
IPC: G02B6/42
CPC classification number: G02B6/4268 , G02B6/4206 , G02B6/4246 , G02B6/4269 , G02B6/428 , G02B6/4204
Abstract: This application discloses an optical module. A circuit board is provided with a first heat dissipation member. One end of the first heat dissipation member is attached with an optical chip, with a lens assembly covering the optical chip. The other end extends outwardly from a coverage region of the lens assembly, so that heat generated by the optical chip is diffused to outside of the lens assembly. One end of the first heat dissipation member away from the lens assembly is provided with a second heat dissipation member whose upper surface being provided with a thermally conductive member. An upper surface of the thermally conductive member is thermally coupled with an upper enclosure. The second heat dissipation member conducts the heat diffused by the first heat dissipation member to the upper enclosure via the thermally conductive member. Thus, heat dissipation is achieved via the upper enclosure.
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公开(公告)号：US12085753B2
公开(公告)日：2024-09-10
申请号：US17481798
申请日：2021-09-22
Inventor： Long Zheng , Sigeng Yang
CPC classification number: G02B6/13 , H05K1/181 , H05K1/182 , H05K2201/10121 , H05K2201/10287
Abstract: An optical module includes a circuit board and a silicon optical chip. The circuit board includes a plurality of circuit board bonding pads. The silicon optical chip includes a plurality of chip bonding pads corresponding to the plurality of circuit board bonding pads. The plurality of chip bonding pads are electrically connected to the corresponding circuit board bonding pads, so that the silicon optical chip is electrically connected to the circuit board. A chip bonding pad is electrically connected to at least one corresponding circuit board bonding pad through a plurality of bonding wires, or a circuit board bonding pad is electrically connected to at least one corresponding chip bonding pad through a plurality of bonding wires. A connecting line of two or more of bonding positions of the plurality of bonding wires on the circuit board bonding pads is inclined with respect to a connecting line of centers of the circuit board bonding pads.
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公开(公告)号：US11990725B2
公开(公告)日：2024-05-21
申请号：US17475775
申请日：2021-09-15
Inventor： Dan Li , Mengbo Fu , Qinhao Fu , Yifan Xie , Tengfei Wang
CPC classification number: H01S3/0405 , G02B6/4206 , G02B6/4271 , G02B6/428 , H04B10/503
Abstract: An optical module includes a shell, a circuit board and an optical transmitter device. The circuit board is disposed in the shell. The optical transmitter device is disposed in the shell, and includes a plate-shaped substrate and a laser assembly. The laser assembly is disposed on a surface of the substrate, is electrically connected to the circuit board, and is configured to emit an optical signal. The substrate is fixedly connected to an end of the circuit board.
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Patent Agency Ranking
公开(公告)号：US20240146417A1
公开(公告)日：2024-05-02
申请号：US18399670
申请日：2023-12-28
Inventor： Honghao ZHANG , Fei LIU , Wei CUI
CPC classification number: H04B10/40 , H04B10/503 , H04B10/506 , H04B10/615
Abstract: Provided is an optical module including a circuit board and an optical transceiver device. The circuit board is provided with a mounting hole and a data processor. The optical transceiver device is mounted on the circuit board and is electrically connected to the data processor. The optical transceiver device includes a mounting shell, a first cover member, a light emission component and a light reception component. The first cover member is disposed on the front surface of the circuit board. A laser assembly and a translation prism assembly of the light emission component are located on the mounting shell and are exposed to the front surface of the circuit board through the mounting hole, and a light exiting direction of a light processing assembly of the light emission component forms a first preset angle with a light entering direction thereof in a plane parallel to the circuit board.
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公开(公告)号：US20230418006A1
公开(公告)日：2023-12-28
申请号：US17957070
申请日：2022-09-30
Inventor： Jianwei MU , Tao WU , Sigeng YANG , Peng HE
CPC classification number: G02B6/4246 , G02B6/425 , H04B10/25
Abstract: An optical module includes a circuit board, a light transmit-receive device and a data processor. The light transmit-receive device includes a first laser array, a first detector array and a first lens assembly. The first laser array is disposed on the circuit board, and is configured to emit a plurality of channels of optical signals driven by the plurality of channels of low-speed electrical signals. The first detector array is disposed on the circuit board, and is configured to receive the plurality of channels of optical signals from outside of the optical module, and convert the plurality of channels of optical signals into a plurality of channels of electrical signals. The first lens assembly covers the first laser array and the first detector array, and is configured to change a propagation direction of optical signals incident into inside of the first lens assembly.
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公开(公告)号：US11828993B2
公开(公告)日：2023-11-28
申请号：US17162173
申请日：2021-01-29
CPC classification number: G02B6/4256 , H04B10/50 , H04B10/60
Abstract: An optical sub-module includes a first casing, a second casing, an adhesive layer and an optical device. The first casing has a top wall and a first sidewall. The second casing has a bottom wall and a second sidewall. A height of the second sidewall in a thickness direction of the bottom wall is greater than a height of the first sidewall in a thickness direction of the top wall, and the second casing and the first casing is connected to form a chamber. The adhesive layer is disposed between a surface of the first sidewall and a surface of the second sidewall, and a coefficient of thermal expansion of the adhesive layer is greater than a coefficient of thermal expansion of the first casing and a coefficient of thermal expansion of the second casing. The optical device is disposed in the chamber and fixedly connected to the second casing.
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公开(公告)号：US11828991B2
公开(公告)日：2023-11-28
申请号：US17235367
申请日：2021-04-20
Inventor： Guangchao Du , Yongzheng Tang , Tao Wu , Jianwei Mu , Shaoshuai Sui , Jihong Han , Sitao Chen , Qian Shao , Bangyu Yu , Benzheng Dong , Xiangxun Sun , Fabu Xu
CPC classification number: G02B6/4215 , G02B6/4206 , G02B6/4266 , H04B10/503
Abstract: An optical module includes an upper shell, a lower shell, a circuit board, a base, a laser assembly and a silicon optical chip. The upper shell and the lower shell form a wrapping cavity. The circuit board is located in the wrapping cavity. The base is located on the circuit board or in a through hole of the circuit board. The laser assembly is located on the base, and is configured to provide light. The silicon optical chip is located on the base, and is configured to receive the light, and modulate the light to convert an electrical signal into an optical signal, and is configured to receive an optical signal from an outside of the optical module and convert the optical signal into an electrical signal.
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公开(公告)号：US20230352905A1
公开(公告)日：2023-11-02
申请号：US18344546
申请日：2023-06-29
Inventor： Xiao CHEN , Yunsong ZHAO , Jingsi LI , Zhicheng LIU , Zhaosong LI
IPC: H01S5/02315 , H01S5/02345 , H04B10/50
CPC classification number: H01S5/02315 , H01S5/02345 , H04B10/503
Abstract: Disclosed is an optical module, comprising: a light emitting component for generating and outputting signal light, including a laser; the laser includes: a laser chip for generating signal light; a substrate which is provided with a chip mounting groove in its top side, a circuit is laid on a top surface of the substrate, the laser chip is arranged in the chip mounting groove, with the laser chip being connected to the circuit via bonding wires.
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