Apparatus and method for inspecting surface of semiconductor wafer or the like
    1.
    发明申请
    Apparatus and method for inspecting surface of semiconductor wafer or the like 有权
    用于检查半导体晶片等的表面的装置和方法

    公开(公告)号:US20020036771A1

    公开(公告)日:2002-03-28

    申请号:US09961513

    申请日:2001-09-24

    IPC分类号: G01N021/00

    CPC分类号: G01N21/9501

    摘要: Light beam is irradiated onto a surface of a substrate to be inspected and scattered lights from the surface of the substrate are received at different light reception angles, so that first and second light detection signals corresponding to the different light reception angles are generated. Reference function defining a correlation in level value between the first and second light detection signals is set, a comparison is made between respective level values of the first and second light detection signals using the reference function as a comparison reference, and it is determined, on the basis of a result of the comparison, which of a plurality of different types of defects, such as a foreign substance and crystal-originated pit, a possible defect present on the surface of the substrate, which is represented by the light detection signals, corresponds to. Also, the level value of a predetermined one of a plurality of the light detection signals is weighted with a predetermined coefficient, and a comparison is made between the weighted level value of the predetermined light detection signal and the level value of the remaining light detection signal, to thereby identify any of a plurality of different types of defects, such as a foreign substance and scratch, present on the surface of the substrate.

    摘要翻译: 将光束照射到要检查的基板的表面上,并且以不同的光接收角接收来自基板表面的散射光,从而产生与不同的光接收角对应的第一和第二光检测信号。 设定定义第一和第二光检测信号之间的电平值的相关性的参考功能,使用参考功能作为比较基准比较第一和第二光检测信号的各个电平值,并且确定为 比较结果的基础,由光检测信号表示的多种不同类型的缺陷中的哪一种,例如异物和晶体起源的凹坑,存在于基板的表面上的可能的缺陷, 对应。 此外,多个光检测信号中的预定一个光检测信号的电平值以预定系数加权,并且比较预定光检测信号的加权电平值和剩余光检测信号的电平值 ,从而识别存在于基板表面上的多种不同类型的缺陷,例如异物和划痕。