公开(公告)号：US10199977B1

公开(公告)日：2019-02-05

申请号：US15783695

申请日：2017-10-13

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： Ali Mohammadpour ,  Andrew Love ,  Louis Pu ,  Mike Guidry

IPC: H02P27/04 ,  H02P27/06 ,  H05K1/18 ,  H05K1/11 ,  H05K1/14

Abstract: Electrical systems and devices with substrate interconnections having reduced parasitic inductance are provided. A first substrate includes one or more capacitors and plurality of connection interfaces, wherein a first subset of connection interfaces electrically connected to a first reference voltage are interleaved with a second subset of connection interfaces electrically connected to a different reference voltage. A second substrate includes a third subset of connection interfaces are electrically connected to a first terminal of a first switching element and the first subset of connection interfaces and a fourth subset of connection interfaces electrically connected to a second terminal of a second switching element and the second subset of connection interfaces, and the third subset and the fourth subset are also interleaved.